Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
The KE3020 is Juki's latest leading-edge technology for improved flexibility and production quality. It supports both electronic and mechanical tape feeders and can handle boards up to 22" x 24". With its multi-nozzle (six nozzles) laser head, the KE
New Equipment | Solder Paste Mixers
PLS186 applies revolution and rotation mixing method with motor, effectively mixes the solid state and liquid state equality, to achieve perfect printing and reflow effect, save the manpower. Of course, it not need to open the pot in order to reduce
The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re
All-in-one mounter with dual gantry modular machine using a 12 nozzle flying camera, achieves the world’s highest placement speed of 82,000 CPH. EXCEN FLEX, a dual gantry modular machine using a 12 nozzle flying camera, achieves the world’s highest
MY600 - Millions of dots ahead of its time. The next-generation MY600 Jet Printer now enables SMT producers to achieve optimal solder joints on complex boards at speeds of more than one million dots per hour, a 50% increase in throughput compared to
New Equipment | Surface Finish
Increase Yields. Improve Quality. Reduce Rework and Rejects. Enthone provides the world’s most applied and preferred PCB final finishes. Offering the widest selection and deepest knowledge of lead-free compatible finishes, we work with leading OEMs,
New Equipment | Solder Paste Stencils
Stentech is at the forefront of the next generation of stencils, Electroformed Stencils, with more than ten years of research and development. Stentech has now been manufacturing quality Electroformed Stencils for over five years for our North Americ
Solid rigid moveable table which achieves highly accurate measurement. The GAM 820 offers a solid rigid X-Y table design and its movement is speedy and accurate. The repeat positioning accuracy is 0.005 mm (0.0002 inch). Fully digital controlled dev
Premo-Flex™ FFC and etched polyimide jumpers, available in a variety of pitches, cable lengths and thicknesses, plus high-temperature ratings up to +105°C, deliver durable, ultra flexible, competitively priced solutions for PCB connections in virtual
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