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Siemens Siplace CP12 Pick And Place Machine

Siemens Siplace CP12 Pick And Place Machine

New Equipment | Pick & Place

Siemens Siplace CP12 Pick And Place Machine Patch speed:24000CPH Dimension:1,500 mm x 1,666 mm Weight: 1,850 kg Feeder Capacity 120 x 8 mm Product description: Siemens Siplace CP12 Pick And Place Machine, Patch speed:24000CPH, Dimension:1,500

Kait High Tech Co.,ltd

SIEMENS X SERIES 8mm Feeder 00141290-06

SIEMENS X SERIES 8mm Feeder 00141290-06

New Equipment | Components

SIEMENS X SERIES 8mm Feeder 00141290-06 SMT Spare Parts Siemens feeder SIEMENS X SERIES 8mm Feeder 00141290-06 USAGE:Siemens pick and place machine Product description: SIEMENS X SERIES 8mm Feeder 00141290-06 SIEMENS X SERIES 8mm Feeder 00

Kait High Tech Co.,ltd

JUKI RX-6R 6B pick and place machine

JUKI RX-6R 6B pick and place machine

New Equipment | Pick & Place

JUKI RX-6R 6B pick and place machine Applicable Components: 0402(01005)~ 33.5mm Board size:50x50~610x590mm Feeder inputs:max.160 placement capacity:42,000 CPH Product description: JUKI RX-6R 6B pick and place machine, Applicable Components: 04

Kait High Tech Co.,ltd

Ultra-Thin Chips For High-Performance Flexible Electronics

Technical Library | 2020-01-15 23:54:34.0

Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics.

Bendable Electronics and Sensing Technologies (BEST)

A Novel Local Search Integer-Programming-Based Heuristic for PCB Assembly on Collect-and-Place Machines

Technical Library | 2011-11-03 18:04:07.0

This paper presents the development of a novel vehicle-routing-based algorithm for optimizing component pick-up and placement on a collect-and-place type machine in printed circuit board manufacturing. We present a two-phase heuristic that produces soluti

Mechanical Science and Engineering at UIUC

ASM Siplace S20/23/F5 software installation manuals

Electronics Forum | Tue Jan 21 18:44:00 EST 2020 | victor

Hello, Could you please help with getting the Station Computer installation manual for 4XXX and 5XXX station software versions? Cheers, Victor

Sm t t net
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