Electronics Forum: 3

Re: PCB warpage

Electronics Forum | Thu Oct 14 20:42:07 EDT 1999 | Jeff Ferry

Grace, As deifned in IPC 7721 Procedure 3.2 Bow and Twist Repair "Bow and twist after soldering shall not exceed 1.5% for through hole PC boards and .75% for surface mount PC boards. The bow and twist shall not be sufficient to cause difficulties d

Interpretation for IPC 600H for Clause 3.3.2 (Lifted Land - Cross Sectioned)

Electronics Forum | Mon Apr 28 15:20:50 EDT 2014 | davef

Your customer is correct. Your supplier has clamped some sort of machine to your butt and has plugged it in the wall outlet. Honest mistake: * IPC-A-600H, 3.3.2 Lifted Lands - (Cross Sections) ... pertains to boards that were cross sectioned after t

MYCRONIC MOD

Electronics Forum | Sun May 07 14:59:39 EDT 2023 | smtusa

Has anyone tried this on a my9/12/15/19? I have a 21.4mm tall component. Any drawbacks about doing this permanently? Max component height is 15 mm as standard but 22 mm with a few modifications. Board edge clearance is 3.2 mm. The top board edge

di water washing

Electronics Forum | Wed May 05 09:00:53 EDT 2010 | davef

IPC-A-610D Sections 3.1, 3.2, and 3.3 and Table 3.1 specifically mention compressed air as a source of ESD damage

Autoprogram for DOS

Electronics Forum | Mon May 21 12:33:32 EDT 2001 | Steve23

Yeah, I actually use Autoprogram 5.3.2 also, but I use it on a Windows95 machine, and it works OK. I would like to get a copy of the DOS version just to see how stable it is.

Re: CALCULATION EQUATION FOR 1 CHIP SOLDERING COST IN SMT PROCESS.

Electronics Forum | Mon Jan 17 10:40:11 EST 2000 | Dave F

Cost = Labor + Production Materials + Overhead Cost = Labor * Overhead Multiplier Cost = (Time For Task*Labor Rate*Benefits) * Overhead Multiplier Cost = ((6sec/3600sec/hr)*$10/hr*1.3) * 2 Cost = $0.04

MYDATA

Electronics Forum | Tue Oct 19 09:52:49 EDT 2004 | blueflag

Please can anyone help we have a mydata running on unix V/386 ver 3.2 We are about to purchase another mydata running linux are the 2 compatable???? Thanks Colin

looking for HASL TIN thickness specification

Electronics Forum | Tue Sep 02 22:21:26 EDT 2008 | davef

IPC-6012 Table 3-2. States "Fused tin-lead or solder coat - Coverage and Solderable". The lack of any specific dimension criteria doesn't make this any less a requirement. There must be complete coverage of solder on the land, and it must be wettable

JOT router

Electronics Forum | Thu Oct 09 08:59:42 EDT 2008 | zigmas

Need SW for (old)JOT router: J501-22.1/1 JR10-D3.2H S No. 105611

Lead Free Solder Paste Evaluation

Electronics Forum | Wed Apr 22 23:25:15 EDT 2009 | jandon

We were using AIM WS485 SAC305 and AIM NC257 SAC305 and we had problems with voiding and AIM�s narrow process windows. Now we are using Indium3.2 and Indium8.9 with much better results.


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