Industry News: 5.24 (Page 2 of 2)

Kester to Host Solder Alloy Task Group at IPC Midwest 2009

Industry News | 2009-08-27 14:17:10.0

ITASCA, IL — August 2009 — Kester announces that David Scheiner will host a Solder Alloy Task Group at the upcoming IPC Midwest Conference. The meeting will be held during Session 5-24c of the Standards Development Meetings, scheduled to take place Tuesday, September 22, 2009 from 1:30- 3 p.m.

Kester

BPM Microsystems Enhances Empty Socket Test Software Feature with the Release of BPWin 5.22.0

Industry News | 2012-02-10 16:36:32.0

BPM Microsystems announces the release of BPWin version 5.22.0, which includes an enhancement to the Empty Socket Test that will now cycle when the interlock has been opened, further reducing the risk of double stacking devices, thus improving programming yield and quality assurance.

BPM Microsystems, Inc.

Tetsuro Nishimura Earns IPC Distinguished Committee Service Award

Industry News | 2018-03-22 20:45:02.0

Nihon Superior today announced that its President Tetsuro Nishimura has received a Distinguished Committee Service Award in recognition and acknowledgement of his extraordinary contributions to IPC and the electronics industry. IPC – Association Connecting Electronics Industries® presented the award at the recent IPC APEX EXPO that took place at the San Diego Convention Center.

Nihon Superior Co., Ltd.

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