Electronics Forum: 5060 (Page 2 of 4)

ERSA versa as alternative to wave soldering in low vol high mix

Electronics Forum | Mon Aug 29 11:47:25 EDT 2005 | stalkerb

Do you have expierience of this type of Machine. approx how many product types are you running on your wave/ersa...? and approx batch sizes We have had a 5060 for about 1 year and it has been a revalation. your input is appreciatted as i am consi

Cover tape tearing

Electronics Forum | Thu Dec 15 19:47:43 EST 2005 | Liza

Hi GS, You mentioned that polystyrene should be sealed by low method. We are currently using the ffg parameters for polystyrene monolayer dull finish carrier tape and AA cover tape. Are these considered low by standard? These are the parameters r

Green inductors

Electronics Forum | Mon Feb 20 08:25:13 EST 2006 | Rob

No problem. If you get no joy you're going to have to change the footprint to a 1206 or 1210. Murata have a range of high Q value inductors (50-60) & from memory Toko used to be pretty hot too. The terminations on the coilcraft part are listed a

DEK Vectorguard develops leak for 3rd time

Electronics Forum | Wed Jan 11 06:29:47 EST 2012 | cbeneat

We have Vectorguard frames we've been using for about 6-8 months. We've seen no leakage on ours. The frame has written on it an operating pressure of 101.5-116.0 psi,our pressure is set a lot lower, 50-60 psi, as we also use another frame that can'

min kV requirement

Electronics Forum | Fri May 31 14:36:12 EDT 2002 | russ

does anybody have any info on what the minimum kV power should be on an X-Ray machine to handle general BGA inspection? I have heard that you need a minimum of 100 kV for the Metal top packages but have also heard of people using 50-60 kV but I don't

REFLOW PROFILE NEED HELP

Electronics Forum | Thu Aug 25 09:56:08 EDT 2005 | james

I ran a profile on a dummy board with no parts and the peak temp is 220. The 220 is just the temperature of the board of course. With that BGA on it, I am pretty sure it sucks up alot of the heat. Also I am looking at the profile and notice that i

PCB Through Hole Size for Lead Free

Electronics Forum | Wed Nov 07 13:00:41 EST 2007 | jdumont

Hello all, we are having issues with some specific package type aluminum caps we use while running lead free. We used to run these leaded with none of these issues. Basically we are not getting more than 25% hole fill on these parts. I have tested di

PCB Through Hole Size for Lead Free

Electronics Forum | Wed Nov 07 13:36:20 EST 2007 | jdumont

Hello all, we are having issues with some specific package type aluminum caps we use while running lead free. We used to run these leaded with none of these issues. Basically we are not getting more than 25% hole fill on these parts. I have tested di

Baking components at 70 degree

Electronics Forum | Sat Jun 28 13:53:07 EDT 2008 | sleech

Fowler: Thank you for your documentation. Your finding roughly coincide with our own. We also found that 70 degree baking removes 50%/60% of the ingested moisture from moisture conditioned MSD packages We ran an additional experiment that compared

Volume and average height of solder paste after printing machine

Electronics Forum | Thu Oct 02 01:47:57 EDT 2008 | myleb

I'm new to SMT. Now, i'm making program for SPI machine to inscpect for solder paste of SP60-MU. I think this is a very good printer but some times, my program shows only 50-60% of volume transfer; and the average height is very high: nearly 200 pct.


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