Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas
IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D
Electronics Forum | Wed Sep 26 16:32:40 EDT 2001 | davef
Placing a component the correct side up: * May affect heat dissipation. [Umm, that sounds like stretch, but who knows what designers think about?] * Allows reading the markings on those components that have markings, however cryptic the notation of
Electronics Forum | Tue Aug 13 09:47:49 EDT 2002 | johnw
Hi Folk's, a quick and easy? question. Got a card with PTH edge stiffeners fitted to it so we need to flow solder them. Having problems getting hole fill, mainly I think due to 2 things, poor pin to hole ratio and also a bit of oxide. The question i
Electronics Forum | Thu May 01 12:28:56 EDT 2008 | petergog
what is the main concern about this reqirement? Why IPC-A-610c is revsised to this? IPC-A-610c said it is a defect.Solder touches the body of a plastic bodied component, eg SOICs and SOTs. But D version think it is acceptable. WHY? I thought "plasti
Electronics Forum | Wed Jun 13 21:30:23 EDT 2001 | davef
We use a great concensus document for inspection. It is: IPC-A-610C, Acceptability Of Electronic Assemblies as the basis for accepting assemblies. You can find it at IPC [http://www.ipc.org]. [Help!!!! I�m turning into an IPC Cal.] We find that m
Electronics Forum | Fri Jun 29 14:13:05 EDT 2001 | markhoch
Just a quick thought on solder balls "or beads" caused when using NC paste. I found a spec (12.4.10 in IPC-A-610C) that says solder beads are acceptable if they are entrapped in NC flux residue and can not be dislodged in the normal service environme
Electronics Forum | Tue Jul 03 22:18:33 EDT 2001 | davef
Assuming that you are talking about voids in solder connections: * Consider voids on the surface of your solder connection a defect. * Consider voids that you can't see to be a process indicator. See A-610C, 12.4.8 for authoritative guidance.
Electronics Forum | Mon Apr 23 07:19:23 EDT 2001 | dahsr
Can I have solder bridging two SM rectangular chip components due to misalignment? The bridging occurs at one end and is on a common trace between the two pads. The components are larger than the pad (side overhang) and are aligned rather perfectly w
Electronics Forum | Thu Nov 01 04:31:47 EST 2001 | ianchan
I refer to IPC-A-610C, section 12.4.5, the defect term "dewetting". Can the experts pls help define the actual stages that constitute the formation of a dewetting defect? I do understand the common concept teachings that there may be contamination
Electronics Forum | Mon Mar 11 11:11:38 EST 2002 | slthomas
Tahnk you for posting the charts. > > They look > very useful, but I have a silly question: In > reflow problems _ What is "leaching" ? Dissolution of the component metallisation into the liquid solder. _ > What is "Halo effect" ? "...a
