Industry News | 2015-10-21 11:40:16.0
GETECH is pleased to announce it has partnered with pb tec solutions in Germany and Austria to market and sell its range of depaneling and marking systems.
Industry News | 2014-08-16 17:55:06.0
Toddco General, Inc. released the new TG-1000 bonding platform to easily support large display panels or other substrates requiring hot bar bonding of flexible circuits, TABs, COF or COG. Designed for process development labs, high-mix production or repair environments.
Industry News | 2017-11-08 15:24:31.0
Nordson DIMA, a division of Nordson Corporation (Nasdaq NDSN), will exhibit a range of products at Productronica, the world’s leading trade fair for electronics development and production, to be held in Munich, Germany, on November 14-17, 2017, in Hall A2, stands 345 and 578.
Industry News | 2017-05-26 14:54:11.0
Versatile Hotbar Bonding System with Motorized Rotary Table for Precision Positioning
Industry News | 2017-11-07 17:14:32.0
Nordson Corporation (NASDAQ: NDSN) announces that eight divisions from its Advanced Technology segment will be exhibiting together at Productronica, the world's leading trade fair for electronics development and production, to be held in Munich, Germany during November 14-17, 2017, in Hall A2, stands 245, 345, and 445.
Industry News | 2019-12-16 22:42:05.0
T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.