Electronics Forum: altera (Page 2 of 4)

BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire

Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a

BGA Non-wet (head in pillow)

Electronics Forum | Wed Nov 15 16:14:02 EST 2000 | Scott Welle

We are having non-wet (head in pillow) problems with Altera 484's similar to the problems discussed on 10/27 timeframe. Need contacts to those people having similar problems. Will those who had problems with Motorola 357 (ref Chris and Glenn on 10/

BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire

Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a

BGA CORNER WARP

Electronics Forum | Mon May 28 17:43:33 EDT 2001 | davef

Does this device have a integral heat sink / metal slug on top, like a TI TM320C6XXX er a Altera EP20K4XX? Compare the size of the pads on the interposer and the board. Compare the type solder mask [NSMD vs SMD] on the interposer and the board. Wh

Double-sided reflow with a Altera 240-pin RQFP

Electronics Forum | Mon Jun 30 09:43:03 EDT 2003 | russ

Try searching the archives, I saw the formula posted in an earlier thread I belive that relating to Double sided with BGAs but I am not sure I think Dave F. posted this one. So what is an "R"QFP I haven't heard of that one before. Russ

QFP Shifting / Solderability Issue

Electronics Forum | Fri Jun 01 22:09:03 EDT 2007 | mika

Hi Aj, What type of QFP are we talking about? We had in the past big problem with QFP-304 0.5mm pitch from ALTERA. Similar as you describe. Note. No problem with QFP-256 or QFP-196 0.5mm pitch, or anytying less than -304:s Can You be a little bit mo

programming SMD flash memory and SMD flash memory in microcontrollers before PCB assembly

Electronics Forum | Fri Jan 15 05:33:05 EST 2016 | jvercamm

hi, I would like to know if SMD parts (soic, small qfp, large qfp and tsop parts) can be programmed before PCB assembly and, if true, which companies can do this. These parts are either embedded microcontrollers with flash memory, flash memory and

Re: power dissipation design

Electronics Forum | Wed Apr 05 22:31:51 EDT 2000 | Dave F

Robert: Out of curiosity, by "BT" do you mean: � Bismaleimide triazine, the stuff used to increase the tg of resins used in some BGA interposers. � British Telecommunications plc, the guys with bad teeth. � BrookTree, the RAMDAC supplier, that�s par

BGA ball Separation

Electronics Forum | Tue Jul 25 12:14:39 EDT 2006 | russ

All my studies led me to believe that it was CTE mismatch of this package. Altera was of less than 0 help in this matter. The other possibility was an ICT test fixture. Unfortunately (?) the design life of this product was at end and the new design

Separate Oven for lead-free reflow

Electronics Forum | Wed Jan 04 13:59:14 EST 2006 | chunks

Ask your customer why they need this? Show them your process. Then bury them in their own unknowledgeable requests. It is pretty scary how many papers are also written about how easy it is to reflow a lead-free BGA with regular leaded paste. ht


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