Electronics Forum | Wed Mar 15 11:27:05 EST 2006 | stepheniii
By any chance is it eutectic paste and pallidium leads? Also how tight are you checking coplanarity? At least with the MPA-G3 you can check so tight that any IC will fail in the real world. Or you can check so loose that you might as well not check.
Electronics Forum | Wed Mar 15 13:25:25 EST 2006 | russ
Your profile is definitely off. It could be bad leads but it sounds like your max temp is too low and the TAL is too short. By how much? Don't know.
Electronics Forum | Thu Mar 16 04:35:49 EST 2006 | vicknesh28
Paste is eutectic and it's copper based parts. Just another observation, i notice that the "flux" between the bottom foot and solidified paste is still in gluey state. Observation on good reflowed leads showed brittle type of flux residue. Can anyone
Electronics Forum | Fri Mar 17 09:32:45 EST 2006 | vicknesh28
It's a no clean paste. Yes it's a single lead (sometimes a few at random locations) and i do notice that corner leads (or close to it) fails more.
Electronics Forum | Tue Feb 21 20:14:50 EST 2006 | Joseph
Dear all, Recently our lead-free samples being rejected due to very dull and sometimes grainy and very porous surface on solder joints. This samples was flow thru' the lead-free wave soldering with SN100C alloy composition. Referring IPC-A-610 D, le
Electronics Forum | Wed Mar 15 09:17:28 EST 2006 | mapell
Vick Russ is very correct. Get the paste material specificatioin. Please get your favorite data logger (ECD, KIC, DatPaq, etc..), attach some TC's and take a profile. This is the ONLY way to know what your reflow system is doing and how to alter.
Electronics Forum | Wed Mar 15 09:28:30 EST 2006 | mapell
Vick I would not think what your seeing is normal. Just guessing without a profile but.... - not reaching peak temperature - not enough soak time or mild ramp to burn away the flux - shortened TAL, not allowing proper time for the solder to wet - lo
Electronics Forum | Wed Mar 15 09:36:43 EST 2006 | vicknesh28
Thanks Marc. I will try the things that u have mentioned. I am guessing if the flux can find its way between the bottom foot of the lead and the paste, there has to be a gap between the solder paste and the lead when reflow takes place. As u have sai
Electronics Forum | Thu Mar 16 10:15:55 EST 2006 | slthomas
I would again suggest that you REALLY need to profile that board. It does sound like you're not getting enough heat to that component, but if you just crank up your reflow zone how will you know you're not overheating something smaller unless you b
Electronics Forum | Thu Mar 16 12:48:12 EST 2006 | russ
The copper based part is it copper that you are soldering to or did you tell us what the base material was for the lead. Generally all leads are plated with something such as Tin/Lead, palladium over nickel, tin, etc... You cannot solder to bare co
