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Microstructure and Intermetallic Formation in SnAgCu BGA Components Attached With SnPb Solder Under Isothermal Aging

Technical Library | 2022-10-31 17:09:04.0

The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.

CALCE Center for Advanced Life Cycle Engineering

YX-801 802 SMD Components Counter

YX-801 802 SMD Components Counter

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Ebsomat 30-1 Component Counter

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CONTACT SYSTEMS SM-850ADV

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CONTACT SYSTEMS COU2000ADV

CONTACT SYSTEMS COU2000ADV

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Motorized electron-optical SMD components counter, works by detecting cut-out holes on SMD reel tapes, accurate and fast. 1,The automatic counter sets up and changes over fast,count out an entire reel or a specific number of parts to prepare for

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Reliable Controls Corporation

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New Equipment |  

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Reliable Controls Corporation

Topoint Cou2000 SMD Reel Counter

Topoint Cou2000 SMD Reel Counter

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Data Weighing Systems

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TAP Checker

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GOEPEL Electronic


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