Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef
There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si
Electronics Forum | Tue Aug 14 19:49:21 EDT 2007 | htran
My apology for not mentioned the J-STD-001DS. I didn't mean to trick you. Anyway thanks for your inputs. You are the man with the smt knowledge, I am sure that I will be asking you for some more answers again. Thank you for the link. I will loo
Electronics Forum | Fri Aug 17 17:55:42 EDT 2007 | htran
My small reflow oven doesn't have the rails (only metal mesh). I personally don't think it was built for double side reflow assembly and there is vibration as well. We are a small low volume mfg house and our reflow oven doesn't have the capability t
Electronics Forum | Sat Aug 18 08:40:34 EDT 2007 | davef
Here's how to double reflow your QFP: * Reflow the first side with the QFP according to plan. * Paste second side and place components according to plan. * Lightly crinkle a small, QFP-size piece of aluminum foil. [Note: the degree of crinklization
Electronics Forum | Thu Aug 16 13:00:32 EDT 2007 | russ
Here is what you need to do if you can, Since you want to shporten the bake time you need to increase temp. weigh a board prior to your current bake process (you need very hi resolution scale for this) weigh the same board after current process a
Electronics Forum | Sat Aug 11 09:33:09 EDT 2007 | davef
Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no baking of assemblies, only boards [and for the anal, components]. J-STD-001DS, 4.9.3 Drying/Degassing. Prior to soldering, the assembly shall be treated to
Electronics Forum | Fri Apr 23 14:27:22 EDT 2010 | hegemon
I am concerned about a 'tarnishing' effect after moisture bake out that affects solderability on a batch of PCBs. This finish is new to us,and I am wondering if anyone has ideas about how to drive the moisture out of the boards without compromising
Electronics Forum | Mon Nov 08 11:11:16 EST 1999 | John Thorup
Believe it! Although it might be necessary in certain rare cases, and as Ray says, as a bandaid, to routinely bake your boards is a mistake. For much more info, search the IPC technet archives over the last few weeks. It was a popular thread
Electronics Forum | Wed Nov 10 09:42:05 EST 1999 | Boca
Generic fabs should not require baking. Some special cases like teflon and flex circuits take moisture very well, they often continue to require a trip to the oven. Best wishes, Boca
Electronics Forum | Fri Apr 23 17:00:31 EDT 2010 | davef
Hegeman: So you receive these boards in seal moisture barrier bags, store them in a controlled environment, and use them as needed; what is your goal in baking these poor babies?
