Electronics Forum | Thu Sep 12 11:50:58 EDT 2002 | stepheno
http://www.jedec.org/download/search/jstd020b.pdf http://www.jedec.org/download/search/jstd033a.pdf The above links are for JEDEC standards regarding moisture sensitivity. SMT magazine has an article a few months ago regarding a company that saved
Electronics Forum | Wed Feb 15 04:25:56 EST 2006 | der
one of the guys was baking a 672BGA . he mistakenly left the oven on over night so instead of baking for 12 hours at 125 degrees C, they got baked for 24 hours. Is there any detrimental impact on the BGAs or are they just well baked???
Electronics Forum | Wed Nov 20 16:53:18 EST 2002 | davef
Q1: How important is the bare PCB baking ? A1: Baking boards is a non-value added activity. Q2: What is the temperature for baking @ what RH ? A2: Search the fine SMTnet Arcives for bake recipes. Q3: What would be the impact for the ENTEK finishe
Electronics Forum | Tue Nov 19 02:59:24 EST 2002 | yngwie
Hi Experts out there, pls help me with the following matters. How important is the bare PCB baking ? What is the temperature for baking @ what RH ? What would be the impact for the ENTEK finished board should the baking is really necessary ? For t
Electronics Forum | Mon Sep 20 16:06:53 EDT 2004 | blnorman
We require that the ovens used for bake out are vented, thus removing the vapor from the oven.
Electronics Forum | Tue Jul 16 00:53:39 EDT 2002 | kennyg
What is a typical time/temp baking cycle for an assembly prior to BGA rework? This bake is intended to prohibit PCB or nearby component damage as well as protect the component being removed for reball. A 24 hr bake at 125C would be great, but often
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
Electronics Forum | Tue Aug 26 03:48:44 EDT 2008 | eyalg
Does anyone know if the IPC 610 standard call for baking bare boards (PWB) prior assembly? Note: I am talking about bare boars only and NOT plastic packages components, Regards. Eyal Green
