Surface Mount Technology Association (SMTA) | https://www.smta.org/board_of_directors/past_members.cfm
& Coating Conference ICEHET (formerly ICSR) IWLPC (Wafer-Level) Medical Electronics Symposium Pan Pacific Certification Upcoming Expos All Expos Symposium on Counterfeit Parts and Materials-Tabletop Exhibition Ohio Expo Heartland Expo Houston Expo Juarez Expo
Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
(MSL and body thickness). To avoid degrading solderability there is a cumulative limit of 48 hours at 125C. 8. The floor life clock is not reset by reflow. Assemblers must track the remaining floor life of MSDs assembled on boards for double-side reflow
Surface Mount Technology Association (SMTA) | https://www.smta.org/board_of_directors/former_members.cfm
& Coating Conference ICEHET (formerly ICSR) IWLPC (Wafer-Level) Medical Electronics Symposium Pan Pacific Certification Upcoming Expos All Expos Symposium on Counterfeit Parts and Materials-Tabletop Exhibition Ohio Expo Heartland Expo Houston Expo Juarez Expo
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications
EVALUATION OF MOISTURE SENSITIVE LEVEL (MSL) AND RELIABILITY OF DEVICES FOR HIGH RELIABILITY APPLICATIONS As Presented at SMTAI September 2003 EVALUATION OF LEAD-FREE SOLDER BONDS AND EFFECTS OF THE LEAD-FREE PROCESS ON DEVICES USING AMI As
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/mixers/in-line-plastic-mixers
& Auxiliary Equipment Animal Health Dosing Syringes Automated Dispensing Systems Components Controllers and Control Systems Dispense Tips and Needles Filling Systems Fluid Dispensers Jet Valve Systems
| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
Heller Industries Inc. | https://hellerindustries.com/delamination/
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
ASCEN Technology | https://www.ascen.ltd/Products/PCB_board_assembly_system/PCB_depaneling_/176.html
Skype:supplier889 PCB Handling conveyor PCB conveyor PCB loader and unloader Solder paste printer PCB buffer Smart Production equipment PCB depaneling machine Axial component lead forming PCB auto optical
ASCEN Technology | https://www.ascen.ltd/Products/PCB_board_assembly_system/PCB_depaneling_/135.html
Skype:supplier889 PCB Handling conveyor PCB conveyor PCB loader and unloader Solder paste printer PCB buffer Smart Production equipment PCB depaneling machine Axial component lead forming PCB auto optical