Electronics Forum | Thu Jun 17 21:24:32 EDT 1999 | Dean
| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an
Electronics Forum | Tue Aug 26 07:44:06 EDT 2008 | davef
Industry-wide, there is no current requirement for baking of bare boards. It adds no value. * IPC-HDBK-001 has guidelines olden times. * IPC-TM-650 has several test methods to determine moisture resistance to both liquid immersion and absorption from
Electronics Forum | Fri Jun 18 15:04:19 EDT 1999 | Scott Cook
| Scott, | | I do hurt easy. Be gentle, at least that's what I tell all the women in my life though quickly diminishing supply - oops. I do not happen to believe this statement. I have seen you dodge many a penned "dart" on this very forum. Since I
Electronics Forum | Fri Jun 18 15:54:29 EDT 1999 | M Cox
| | Scott, | | | | I do hurt easy. Be gentle, at least that's what I tell all the women in my life though quickly diminishing supply - oops. | | I do not happen to believe this statement. I have seen you dodge many a penned "dart" on this very foru
Electronics Forum | Tue Jul 16 01:12:31 EDT 2002 | ppcbs
We find that baking PCB assemblies at 90 degrees C in a Blue M forced air oven is safe for most all PCB's that we have encountered over the past 12 years. We remove any external plactic hardware that may be attached to the assembly and also like to
Electronics Forum | Tue Jul 16 00:53:39 EDT 2002 | kennyg
What is a typical time/temp baking cycle for an assembly prior to BGA rework? This bake is intended to prohibit PCB or nearby component damage as well as protect the component being removed for reball. A 24 hr bake at 125C would be great, but often
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
Electronics Forum | Mon Dec 23 07:33:04 EST 2013 | aflex
It totally depends upon the configuration of both bare PCBs and assemble PCBs.
Electronics Forum | Mon Dec 23 00:22:58 EST 2013 | basheermd
One of our production plant is currently using your SEica Flying Probe Tester whose model and serial no. is furnished below. Model S22 MT Serial No. 200594. Now, they want to use it for both bare pcb and assemled pcb testing. Please furnish th
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
.gif)
