Electronics Forum: before (Page 2 of 505)

Cleaning before Conformal Coating

Electronics Forum | Fri Sep 09 17:01:40 EDT 2005 | GS

You can find some input on IPC-HDBK-830 Guidelines for Design, Selection and Apllication of Conf Coating. Also look at IPC-CH-65A, Guidelines for Cleaning of Printed Board Assemblies. Regards...........GS

Cleaning before Conformal Coating

Electronics Forum | Mon Sep 12 14:08:33 EDT 2005 | Amol

The fluxes used in the board manufacture are RMA fluxes. The board is cleaned according to the IPC standards and tested to ensure quality. I am thinking of designing a DOE to isolate the problem

Cleaning before Conformal Coating

Electronics Forum | Mon Sep 26 15:12:38 EDT 2005 | Amol

hi, sorry for the late reply. We solved the problem by rinsing the boards in deionized water after alcohol scrub

Labeling before paste printing

Electronics Forum | Tue May 03 07:05:52 EDT 2022 | SMTA-64386201

Yes, I fully agree on the pain of traceability and on laser etching. We are aiming to go the laser route in the long run

Labeling before paste printing

Electronics Forum | Tue May 03 07:08:41 EDT 2022 | SMTA-64386201

We do have a CyberOptics SQ3000 that is currently only used for AOI, but I hope to start doing sample 3D SPI with it soon.

Labeling before paste printing

Electronics Forum | Wed Mar 23 11:40:21 EDT 2022 | SMTA-64388039

In my experience a distance of 30 mils per 1 mil in height above PCA nominal is sufficient for the squeegee blade to bend (in the direction of squeegee travel) so that you don't have excessive solder issues near the label. Labels are about 5 mils ta

Cleaning before Conformal Coating

Electronics Forum | Mon Sep 12 14:38:56 EDT 2005 | patrickbruneel

Amol, Your problem is already very isolated only one part has the problem (the part that is hand soldered) Manual cleaning is very difficult. Why are you not considering a no-clean cored solder to solder the one part and skip the manual cleaning. Do

SMT before through-hole

Electronics Forum | Tue Aug 14 10:51:18 EDT 2007 | erhard

standard procedure for this would be to solder SMDs on the bottom side and the LEDs all at once on the wave - if the layout is ok for the wave. You would have to glue the SMD components, for this you would have to use a glue dispenser or a special hi

SMT before through-hole

Electronics Forum | Tue Aug 14 15:08:32 EDT 2007 | gmoritz

pick/place head won't travel over the LED's, then you won't be able to proceed. I wasn't clear in describing my board layout; It is LEDs on one side and SMT components on the other side. I don't think we can get around the problem of stenciling

SMT before through-hole

Electronics Forum | Tue Aug 14 16:23:31 EDT 2007 | stepheniii

I've never seen them used or even heard of them being used like this but you might want to look at http://www.sipad.com/ You will still have to work out other issues like how to keep the SMT on while you wave the LEDs. Maybe you can get these board


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