BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
Demonstration of BGA rework via stencil printing. BEST's StikNPeel stencil is an adhesive backed stencil which allows users to stick the stencil in to place and simply peel it off the PCB with a temporary adhesive system. This leaves consistent print
Aerotech's Surface Measurement Platform (SMP) The SMP is a complete multi-axis motion system that is specifically designed to provide an ideal motion platform for surface measurement applications. The SMP is optimized to provide more flexibility in
Our new PNP-Creator job preparation softare is a real WSWYG editor to setup all parameters during job preparation. Gerber file import show PCB representation. Feeder file import is used for feeder assignment. We are able to import a wide range of
Mark Gallant from DownStream Technologies presents an overview of BluePrint PCB documentation tool
ScanINSPECT BGA uses an intuitive process flow interface integrated with a high resolution, 2-D image-processing unit. This combination allows 100% inspection of ball placement on BGAs, in or out of trays (JDEC, etc.). This is Part 1: How to progr
ScanCOMPONENT is a PC-based offline component programming system for the creation of vision data files from the smallest flip chip and bumped packages to the largest odd form devices. The ScanCOMPONENT is a standalone Product as well as a module of
Swiftmode's Hyperclean Under Stencil SMT Wiper Rolls are the only product in the market that has beed developed specifically for the application. Best vacuum performance, less IPA usage and No loose fibres making the solder paste printing process mor
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
