Electronics Forum | Thu Nov 05 20:53:37 EST 2015 | shuttlestar
It's a strange task . if your PCB is very very small ,using topside heat is not a big problem . but for a whole PCB board . if delete the step of preheat, it will broke the whole PCB . BTW,do you finish your task ?
Electronics Forum | Thu Aug 12 10:49:22 EDT 1999 | Ray Hare
I am currently involved with designing a pcb which will use 225 pin bga,s The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is use the middle 6 or 7 rows of balls as the grounding,th
Electronics Forum | Sat Mar 28 06:59:03 EDT 2015 | robertwillis
I would agree with the comments so far its much better to have some pre heat. You have not explained why bottom side preheat is a problem. Even having some input will help balance the process. Assume there is some thing on the back side that is a pro
Electronics Forum | Thu Sep 25 16:01:25 EDT 2003 | denis
We bought a Ersa rework station (IR technology) recently and we found in trouble when having to replace BGA with metal heat sink cover. I am affraid that we will probably have to invest money again in a convection rework system. Does someone can refe
Electronics Forum | Thu Sep 25 17:19:17 EDT 2003 | bpeay
Greetings Denis, Could you be a little more vague on the type of BGA. Who happens to make this beaty? Is it a TI DSP? B
Electronics Forum | Thu Aug 12 17:15:56 EDT 1999 | Jim Blankenhorn
| I am currently involved with designing a pcb which will use 225 pin bga,s | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | use the middle 6 or 7 rows of balls as the ground
Electronics Forum | Fri Aug 13 04:12:41 EDT 1999 | ray hare
| | I am currently involved with designing a pcb which will use 225 pin bga,s | | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | | use the middle 6 or 7 rows of balls as the
Electronics Forum | Fri Sep 26 08:15:01 EDT 2003 | Gabriele
Forced gas (hot air or N2 according to solder paste or flux) will be the solution. To rework Ceramic (Aluminum lid Heat Sink)BGA (32 mm square ) or Ceramic Colum Grid Array C-CGA 1,25 and 1,00 mm colum (pitch 42,5mm square), also them capped with a
Electronics Forum | Thu Sep 25 18:31:24 EDT 2003 | davef
Denis: You could be correct about metal reflecting IR. When we use our old IR station, we place pieces of aluminum foil around the component to be removed to protect the near-by components.
Electronics Forum | Thu Sep 25 17:35:28 EDT 2003 | denis
To be precise, the component is a Xilinx Virtex platform FPGA with 1152 balls. We also assemble some DSPs up to 1000 balls with metal cover. At best, we can remove the components but it is almost impossible to find a working solder profile using IR.
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