Electronics Forum: bga reflow (Page 2 of 139)

cost effective bga remove

Electronics Forum | Wed Mar 17 19:57:08 EST 2004 | Dreamsniper

Do you wanna save the BGA or what? Do you have an electric stove, baking tray and a BBQ clip? Does your wife love cooking? if u have one of each, then u don't need a reflow oven which is too expensive and you don't need to buy heating guns or drill p

mirco bga stencil opening

Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton

We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac

vacuum reflow

Electronics Forum | Fri May 14 16:49:17 EDT 2021 | winston_one

Agree with WiIIR and also can recommend to play with vaccum pump RPM . Slower vacuum increasing have help me to resolve one problem caused by the vacuum (it was solder splash from BGA balls, but the reason can be similar to your case). Also check i

BGA reflow on bottomside

Electronics Forum | Wed Nov 21 04:08:12 EST 2007 | aj

Thanks guys. Chunks - how many zones do you have in your oven ?

BGA reflow profile

Electronics Forum | Mon Dec 27 11:15:17 EST 1999 | g cronin

please send me a copy of sample reflow profiles for BGA packages. Please indicate the type of BGA and the Oven used. As well as any special characteristics of the assembly that have effected the profile. I a trying to learn more about the common "t

BGA reflow on bottomside

Electronics Forum | Tue Nov 20 04:48:21 EST 2007 | beta

Hi all, I have never had to run a product with BGAs on the bottomside of a double sided board. I was just wondering if this is a done thing ? or should I stay well clear. any replies appreciated. aj...

BGA reflow on bottomside

Electronics Forum | Tue Nov 20 12:25:52 EST 2007 | realchunks

It can be done. But as Rob states, use edge rail oven. We have a product 18 inches long by 9 inches wide with BGAs on both sides.

BGA reflow profile

Electronics Forum | Mon Jul 27 13:59:11 EDT 1998 | Robert Steltman

We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on nickel finish 3) ceramic BGA with eutectic balls Refl

BGA collapse during reflow

Electronics Forum | Mon Jul 12 09:13:08 EDT 1999 | Mark Charlton

I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-layer

BGA reflow on bottomside

Electronics Forum | Wed Nov 21 08:45:33 EST 2007 | davef

Rob: You say, "We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend to run that side first." We agree


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