Industry News: bga shape creation (Page 2 of 8)

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2016

Industry News | 2016-02-17 17:07:17.0

“The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1334 at the 2016 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place March 15-17, 2016 at the Las Vegas Convention Center.

MIRTEC Corp

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2017

Industry News | 2017-01-11 18:22:38.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #3101 at the 2017 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 14-16, 2017 at the San Diego Convention Center.

MIRTEC Corp

SMT mounter Feeder common types and classification from KINGSUN

Industry News | 2023-08-17 14:26:37.0

Today, KINGSUN shares with you the common types and classifications of SMT mounters.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Library Expert Professional is now FREE

Industry News | 2018-02-01 02:56:53.0

More is not less, rather more is completely free. These newly released features were originally available to our enterprise-level customers, and now available at absolutely no cost, no obligation, no strings attached, to automate creation of tens of millions of parts...

PCB Libraries, Inc.

SMTA Announces International Conference on Soldering and Reliability (ICSR) Program

Industry News | 2012-03-08 22:21:34.0

The SMTA is pleased to announce the program for the 2012 International Conference on Soldering and Reliability being held May 15-18 in Toronto, Ontario, Canada. Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto since 2007, this conference will bring together the community of soldering and reliability experts. The event will be co-located with the SMTA Lead-Free Academy and the SMTA Toronto Expo.

Surface Mount Technology Association (SMTA)

IPC’s Revised BGA Guideline Features Expanded Focus on Mechanical Reliability

Industry News | 2013-01-30 17:54:43.0

Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.

Association Connecting Electronics Industries (IPC)

Automated IC Programming: 11 Package Types

Industry News | 2024-01-02 07:59:07.0

Explore the versatility of Automated IC Programming Systems, decoding a myriad of package types for precise and efficient electronics manufacturing.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

PB Swiss Tools Meets Innovation and Design Demands

Industry News | 2011-10-03 17:01:46.0

Count On Tools announces that PB Swiss Tools’ product development meets the demands of innovation and universal design. Due to worldwide demographic changes, top quality products are expected to be primarily simple and functional.

Count On Tools, Inc.

PB Swiss Tools Meets Innovation and Design Demands

Industry News | 2012-05-30 15:56:08.0

Count On Tools Inc. announces that PB Swiss Tools’ product development meets the demands of innovation and universal design

Count On Tools, Inc.

IPC Issues Call for Participation: Help Shape the Future of Design for Environment Standards

Industry News | 2022-08-26 08:58:41.0

IPC's Design for Excellence (DFX) guidelines document, IPC-2231 provides a framework to establish a design review process for the layout of printed board assemblies. This design review assesses the manufacturability attributes of printed boards, namely design for manufacturing, fabrication, assembly, testability, cost, reliability, environment, and reusability. IPC is aware of the responsibilities that electronics manufacturing companies will soon have to regulatory bodies around the world as well to the environment.

Association Connecting Electronics Industries (IPC)


bga shape creation searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for handload Selective Soldering Needs

High Throughput Reflow Oven
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

World's Best Reflow Oven Customizable for Unique Applications
Global manufacturing solutions provider

Wave Soldering 101 Training Course
PCB separator

Find a wide selection of nozzles, solder materials, storage solutions and more at SALESCON