Electronics Forum | Sat Aug 27 09:47:05 EDT 2005 | davef
From the pic, we see blistering, but none so close to via that we'd attribute the blistering to via, via plugging, or anything of the sort. When we see blisters like this, we think of a surface contaminant being present on the boards at the time of
Electronics Forum | Wed Dec 21 22:31:17 EST 2005 | davef
If we received heatsinks with blisters on the contact surface, like you describe, we'd reject them. We want that surface to be perfectly flat. Google "heatsink flatness" for more. For instance: http://www.heatsink-guide.com/content.php?content=hea
Electronics Forum | Thu Jan 19 21:43:33 EST 2006 | davef
Specifically, what element of the bare board is blistering? Tg of 140 could be acceptable. Search the fine SMTnet Archives for background on decomposition temperature [td]
Electronics Forum | Fri Jan 20 13:25:07 EST 2006 | Gary Kemp
The mask/copper layer is exhibiting popcorn blistering following reflow. With profiling we know that the assembly does not see anything close to 250 C, rather around 238 C.
Electronics Forum | Thu Jul 09 11:20:24 EDT 1998 | Justin Medernach
| I am looking for a little enlightement with an issue that we have been seeing. We have printed curcuit board with multilayer and HAL finished. | After reflow soldering, we have often "blister phenomenon". | Our reflow profile is normal. Factory
Electronics Forum | Tue Aug 23 03:42:10 EDT 2005 | Adeline
presently, the production facing this problem. We has couple of brd which is electroylic gold finishing with plug via. The brd has blister after the PCBA (in lead free temperature, 265 degree) Some time, bare brd already has the blisters. But most of
Electronics Forum | Fri Jul 28 08:34:47 EDT 2006 | Chunks
What does your reflow profile look like?
Electronics Forum | Fri Jul 28 12:37:55 EDT 2006 | Chunks
Yes I agree with the termination problem and the Friday thing!
Electronics Forum | Fri Jul 28 13:55:12 EDT 2006 | mumtaz
Please. Why over engineer this the end. Simply wave solder them!
Electronics Forum | Thu Jan 19 20:40:52 EST 2006 | Gary Kemp
We are experiencing a blistering problem during our process of lead free assembly. The customer has supplied us with the bare fab rated at 140 Tg. I am under the assumption that the Tg rating should at minimum be 170. Does anyone know if there is
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