Electronics Forum | Fri Nov 23 07:51:25 EST 2007 | shy
kindly help to advice me either epoxy/glue at bottom SMT component such as chip package 2012 will cause the component to be non-wetting after run reflow process?
Electronics Forum | Tue Nov 27 06:11:42 EST 2007 | shy
Hi Loco, my PCBA got top side and bottom side and 90% SMT and 10% THP (top side) which need to be cover by wave solder. And that's why i need to go through reflow and wave.
Electronics Forum | Tue Nov 27 07:36:29 EST 2007 | shy
solder the part is for SMT component (located at top side and bottom side) and wave solder is for THP (located at top side only).
Electronics Forum | Mon Dec 03 02:23:12 EST 2007 | lococost
yigh, loose the glue, put paste on ALL bottom SMD components and cover ALL SMD components with peel off before wave.
Electronics Forum | Mon Nov 26 10:36:19 EST 2007 | davef
Sure, if you slopper or schmush chipbonder onto pads, solder will not take on that portion of the pad, regardless of the component.
Electronics Forum | Mon Nov 26 20:05:52 EST 2007 | shy
Hi Real Chunks, kindly help to elaborate more on the potential problem that i will face?
Electronics Forum | Thu Nov 29 10:39:42 EST 2007 | realchunks
Electronics Forum | Thu Nov 29 13:02:33 EST 2007 | slthomas
Ahhh, our first casualty.
Electronics Forum | Thu Nov 29 17:59:46 EST 2007 | davef
Electronics Forum | Sun Dec 02 16:42:53 EST 2007 | stepheniii
Does that work well with a "lights out" factory?