Electronics Forum | Wed Jun 09 17:29:59 EDT 1999 | Earl Moon
| I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | There is anybody has experience on metal-based PCB reflow process? I guess
Electronics Forum | Thu Jun 10 11:23:10 EDT 1999 | Gang Pan
| | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | There is anybody has experience on metal-based PCB reflow process? I g
Electronics Forum | Thu Jun 10 12:10:41 EDT 1999 | Earl Moon
| | | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | | There is anybody has experience on metal-based PCB reflow process?
