Electronics Forum | Wed Jul 03 15:40:17 EDT 2013 | davef
Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied than on the grain structure. When shearing a component, you not only apply shear stress, but also roll
Electronics Forum | Thu Jan 02 11:35:30 EST 2003 | Richard
Cleanliness test � �Area Grid Arrays�. Evaluation of residues� resistivity in a specific location on the board. (As compared to �Solvent Extract� evaluation.) We are: SMT assembly, using standard �water soluble� process with micro BGAs (example: C
Electronics Forum | Fri Apr 11 11:26:09 EDT 2003 | Brian W.
Cracked capacitors usually are not found at ICT. Unless the cap is completely cracked, the capacitance may not change much, and the usual failure mode is a leakage current. This is usually only seen in ESS type testing, when temperature and humidit
Electronics Forum | Fri Apr 11 00:32:17 EDT 2003 | Joe
Hello, Regarding the failures not showing up at ICT. Failed decoupling caps are notoriously difficult to diagnose within ICT. Check with your test engineering folks and ask them how they've coded for these parts. I doubt that they will say those
Electronics Forum | Fri Dec 16 07:42:05 EST 2005 | pavel_murtishev
Good evening, We noted one more very strange problem with flash memory chips. Device fails test due to flash chip malfunction. From the first sight open joint or cold joint can cause such problem. But all chip legs are soldered well. We just heat th
Electronics Forum | Fri Apr 11 14:53:50 EDT 2003 | MA/NY DDave
Hi A lot of good answers. "No verification was done on the part as it was deemed to be a "straight replacement". Sound familiar?" Yes this sounds familiar, yet I am never sure it is a new supplier or component problem. It could be that the old par
Electronics Forum | Thu Apr 10 05:25:43 EDT 2003 | dst
Hi, My company is currently experiencing a high feild failure rate on a 100nF chip ceramic that we use in various applications across our product range. One of them being de-coupling which means we use millions of this device every month. The failu
Electronics Forum | Thu Sep 11 15:23:31 EDT 2003 | Peter L.
I have come across a rash of failed assemblies that have 0805 capacitors and resistors, bottom side glued, wave soldered and washed. Trouble shooter reported touching up the solder joints on a few areas and the boards would pass test. I had a look a
Electronics Forum | Thu Feb 18 20:24:37 EST 1999 | Tony
I'm trying to replace the PTH connectors with the SMT connectors in my design, and would like to make sure the SMT connector solder joints are as stong as PTH's. What's the right test to verify that? Is Pull and Shear test is the right choice? Where
Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
