Industry News | 2013-01-04 08:55:03.0
Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder
Industry News | 2019-01-14 19:51:49.0
Finetech will demonstrate the new SMART DESOLDER 01 at the upcoming IPC APEX Conference scheduled for January 29-31 in San Diego (booth #2427).
Industry News | 2013-01-16 13:48:03.0
Finetech will highlight the FINEPLACER® core rework system in booth #1205 at the upcoming IPC APEX EXPO
Industry News | 2020-10-04 16:00:55.0
Indium Corporation's Jonas Sjoberg, Associate Director for Global Technical Service & Application Engineering, will host an InSIDER Series webinar regarding the implementation of high-density assemblies in electronic products on Tuesday, October 13 at 8 a.m. New York Time (1 p.m. British Time/8 p.m. Malaysia Time).
Industry News | 2019-01-16 20:44:36.0
Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award.
Industry News | 2019-06-04 17:05:11.0
Over 25 years of experience in financial leadership roles
Industry News | 2013-03-11 09:10:32.0
A FINEPLACER® Pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University.
Industry News | 2012-08-29 10:27:05.0
Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012.
Industry News | 2013-11-08 18:07:48.0
Finetech has developed a new high force configuration of the FINEPLACER® pico ma platform targeting leading-edge anisotropic conductive film (ACF) applications.
Industry News | 2010-11-03 21:54:19.0
Teradyne, Inc announced that Unisem has selected the ETS-88™ test system from Teradyne’s Eagle Test business unit, based on the platform’s scalability, flexibility and superior test economics.
