Technical Library | 2019-09-25 04:36:01.0
What is the main function of hot air dry oven? Drying ovens are devices used to remove moisture and other solvents from the items placed inside them through a forced convection process, collecting it elsewhere so that the object becomes dehydrated. A drying oven causes objects to dry out through evaporation. Drying ovens use convection heating,also called air forced, in which the object is heated through air currents. Water from the object escapes into the air, raising the humidity level and causing the semi-solid membranes inside the oven to absorb the water. The end result is that the oven removes water from the object being dried, leaving it dehydrated. Drying ovens contain a system for forcing convection currents to develop, usually either a fan or turbine, which aids in the heating and drying process by ensuring that the hot air circulates,many ovens are equipped with an adjustable ventilation system that allows the user to ensure that the system has an adequate air supply. For details,pls visit our website: https://climatechambers.com/articles&latestnews/what-is-the-main-function-of-hot-air-dry-oven.html
Technical Library | 2024-02-05 17:51:01.0
Objective: Drying = reducing the humidity in PCB before soldering Preventing delamination caused by thermal stress after moisture absorption Methods: Drying in convection and/ or vacuum oven Parameters subject to material type, soldering surface, layer count, time to soldering, layout (copper-plated areas)
Technical Library | 2011-01-27 16:57:42.0
In this paper, we will talk about reflow in an enclosed oven, although many of these discussions may pertain to wave soldering and even vacuum soldering..
Technical Library | 2020-07-29 19:58:48.0
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low cost LED lighting and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits. Aluminum is not easy to solder components to at low temperatures and PET cannot withstand high temperatures. Soldering to these materials requires either an additional surface treatment or the use of conductive epoxy to attach components. Surface treatment of aluminum includes the likes of Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet-chemistry and cost-prohibitive for mass adoption. Conductive adhesives, including Anisotropic Conductive Paste (ACP), are another alternate to soldering components. These result in component substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented that addresses all these constraints. Once applied on Aluminum surfaces using conventional printing techniques such as screen, stencil, etc., it is cured thermally in a convection oven at low temperatures. This surface treatment is non-conductive. To attach a component, a solder bump on the component or solder printed on the treated pad is needed before placing the component. The Aluminum circuit will pass through a reflow oven, as is commonly done in PCB manufacturing. This allows for the formation of a true metal to metal bond between the solder and the aluminum on the pads. This process paves the way for large scale, low cost manufacturing of Al-PET circuits. We will also discuss details of the process used to make functional aluminum circuits, study the resultant solder-aluminum bond, shear results and SEM/ EDS analysis.
Technical Library | 2011-01-06 18:03:18.0
The oven recipe, which consists of the reflow oven zone temperature settings and the speed of the conveyor, will determine a specific time‐temperature profile for a given PCB assembly. In order to achieve a good quality PCB assembly, the time‐temperature
Technical Library | 2014-06-23 14:50:52.0
It was unusual to see chip terminations change colors when tin lead solders were used but with the introduction of lead free reflow soldering and the corresponding increases in reflow temperatures terminations are now changing colors. Two conditions are present when reflow temperatures are increased for lead free solder alloys that leads to discoloration. Reflow temperatures are above the melting point of tin (Sn MP is 232oC). Air temperatures commonly used in forced convection reflow systems are high enough to both melt the tin plating on the termination allowing it to be pulled into the solder joint due to solder joint liquid solder surface tension leaving behind the exposed nickel barrier. Now those metal oxide colors will be visible due to high air temperatures during reflow.
Technical Library | 2019-11-13 02:09:44.0
Dry oven is a must instrument almost for every laboratory in different industries,with nearly 20 years efforts and innovation,Climatest now masters core technique of dry oven manufacturing,no matter on temperature uniformity or temperature stability.Behind the quality is 15 years of consistent persistence,strong belief in excellence; from design to R & D to production, from promotion to sales to installation; every step should reach excellence,What you see, you use our products, you choose, you feel that we do our best,this is our faith. Dry Ovens are used to dry or temper electronic components,material tests,torrefaction, wax-melting ,high temperature aging ,preheating and sterilization in industrial and mining enterprises, laboratories and scientific research institutes. .Exterior chamber is made by reinforced steel with painting; working chamber made by anti-corrosion stainless steel SUS#304 .Intelligent PID control, LED controller with over-temperature alarm,timing range within 0~9999min .Hot air circulation system composed of Germany imported low-noisy air blower and optimal air duct which ensure uniform temperature distribution .Double layers of glass door, large transparent window to observe specimen .Forced air convection Climatest manufactures desktop and floor-standing models with RT+10°C-200°C,250°C,300°C,350°C,400°C temperature range,and customized as per special requirement,if you wanna know more details about our dry oven,please visit our product page:https://climatechambers.com/industrial-dry-oven/200-degree-c-hot-air-oven.html
Technical Library | 2011-08-04 19:29:53.0
This work covers two major projects aimed at increasing quality and efficiency on a high mix, low volume surface mount electronics production line. Specifically the installation of a ten zone reflow oven and an enhanced changeover method for SMT pick and
Technical Library | 2016-09-19 20:26:36.0
This white paper seeks to set out the value of a ‘smarter’ approach to the reflow process and how a more intelligent oven can offer real added value and performance to the entire line. It also lays out some of the criteria that is important when selecting smart equipment for a smart process, that conforms to, and is ready for, IoM or Industry 4.0
Technical Library | 2019-07-02 23:02:05.0
The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin systems and activators that are active at elevated temperatures. As a result, more frequent maintenance of the filtration systems is required and machine downtime is increased.Last year a different method of cleaning reflow ovens was introduced. Instead of cooling down the process gasses to condensate the residues, a catalyst was used to maintain the clean oven. Catalytic thermal oxidation of residues in the nitrogen atmosphere resulted in cleaner heating zones. The residues were transformed into carbon dioxide. This remaining small amount of char was collected in the catalyst. In air ovens the catalyst was not seen as a beneficial option because the air extracted out of the oven was immediately exhausted into the environment. When a catalyst is used in an air environment there is not only the carbon dioxide residues, but also water. When a catalyst is used in an air reflow oven the question is where the water is going to. Will it condensate in the process part of the oven or is the gas temperature high enough to keep it out of the process area? A major benefit of using a catalyst to clean the air before it is exhausted into the environment is that the air pollution is reduced dramatically. This will make environmental engineers happy and result in less pollution of our nature. Apart from this, the exhaust tubes remain clean which reduces the maintenance of air ovens.This paper will give more detailed information of catalyst systems during development and performance in production lines.
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