Full Site - : corner bga (Page 2 of 32)

ALLTEMATED, INC.

Industry Directory | Manufacturer

Alltemated sets the standard for tape and reel packaging, IC programming, lead trim/forming, bake and dry-pack services and carrier tape manufacturing.

JOT Optical BGA Rework Station FG-

JOT Optical BGA Rework Station FG-

Parts & Supplies | Repair/Rework

Three independent heaters control systems. FG-P6000 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking

Goodluck Electronic Equipment Co.,Ltd

SMT Adhesives

SMT Adhesives

New Equipment | Dispensing

We offer a full range of SMT adhesives that are suitable for markets ranging from automotive to consumer electronics and everything in between. These adhesives are suitable for all common application methods including printing, standard and high spe

Plastlist Group

Christopher Associates Offers Koki Surface Mount Adhesives

Industry News | 2010-11-01 21:16:27.0

Christopher Associates today announced that the company now carries Koki’s Surface Mount Adhesives (SMAs). The silica-filled epoxies are ideal for chip attachment during wave solder and double-sided reflow.

Christopher Associates Inc.

MacDermid Alpha Presents Technical Paper at SMTA Penang Chapter

Industry News | 2022-09-15 06:27:38.0

The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present the technical paper: "Edge Bonding as Viable Reinforcement For Solder Joints in High Reliability Applications" at the SMTA Penang Chapter Expo & Technical Forum 2022 taking place from September 21 - 22 in Penang, Malaysia.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to Launch ALPHA HiTechHigh Tg, Low CTEUnderfill and CornerfillBonding Materials

Industry News | 2021-01-17 17:50:26.0

The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.

MacDermid Alpha Electronics Solutions

Universal Instruments Universal AdVantis AC-30L SMT Placement

Universal Instruments Universal AdVantis AC-30L SMT Placement

Used SMT Equipment | Chipshooters / Chip Mounters

30 intelligent spindle assemblies      -> All vision processing is performed “on the fly” to maximize throughput.      -> Continuous updates of X, Y, and Z-height pickup and placement locations ● On-The-Head Cameras      -> narrow field of view c

Capital Equipment Exchange

PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12

PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12" x 12")

New Equipment | Rework & Repair Equipment

Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,

PACE Worldwide

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle Performance and Eliminates Underfill

Industry News | 2011-04-07 20:23:54.0

Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.

Zymet, Inc


corner bga searches for Companies, Equipment, Machines, Suppliers & Information

Online Equipment Auction Jabil Monterrey MX Aug 19, 2024

Training online, at your facility, or at one of our worldwide training centers"
Blackfox IPC Training & Certification

High Throughput Reflow Oven
Fluid Dispensing, Staking, TIM, Solder Paste

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
SMTAI 2024 - SMTA International

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
High Throughput Reflow Oven

Best Reflow Oven
design with ease with Win Source obselete parts and supplies

Training online, at your facility, or at one of our worldwide training centers"