New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC,
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
FR408 High Speed, Low Loss Modified Epoxy FR408 is a high-performance FR-4 modified epoxy laminate & prepreg system designed for advanced circuit applications. Its low dielectric constant and low dissipation factor make it an ideal candidate for br
Don't Sacrifice PCBs for Profiling Double Sided Thermally Conductive Tape Used for Attaching Thermocouples to PCBS. Non-destructive TC attachment Reliable TC readings No waiting for curing or soldering Fast, easy setup Sold in 1
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
LEN 66A is one part 100% solid, super fast UV curable bonding adhesives, which has been designed for lens attachment, protective cover windows and touch screens. It can also be used for LCD lamination and sealing, polarizer lamination and touch scree
BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
New Equipment | Board Handling - Storage
We have made the Rogers 4350B core pcb boards. from 2 layer to 30 layers. We have many kinds Rogers base pcb materials. RO4000® Series High Frequency Circuit Materials (ALCANTA PCB Web: alcantapcb.com) RO4000® hydrocarbon ceramic laminates
SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes
SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework). SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminat
