Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest
Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te
Electronics Forum | Tue Jun 19 18:15:22 EDT 2001 | davef
What do you mean when you say "structure"? Taking a different tact to get at an answer to the original question, if applications such as general, BGA attach, and die attach inspection require a resolution of 10 units. What would you suggest are the
Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F
Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process
Electronics Forum | Wed Mar 29 18:17:16 EST 2000 | David
Does anybody out there have experience building electronics assemblies with DCA (Direct Chip Attach - bare die onto PCB) and wire bonding? - What Die Bonder/Dispensing Machines are recommended? - What brand conductive epoxy were used to attach die?
Electronics Forum | Fri Jun 27 08:41:40 EDT 2014 | hungikuo
Is it safe to let Au80Sn20 reflow twice? What I am saying is, for example, die attach using Au80Sn20, followed by lid seal using same Au80Sn20 solder, will it create any problem on the die which was first attached using same soldering material? My
Electronics Forum | Tue Jun 04 19:33:16 EDT 2002 | rob_thomas
Dave's estimation is pretty conservative but there is a lot of equipment out there and a lot of people happy to make a sale.Implementing both mentioned processes it's difficult and time consuming .Even if you get good training from whoever sells you
Electronics Forum | Tue Mar 15 13:24:44 EST 2005 | pjc
There is equipment available to clean NC residues off low standoff devices, well below 0.8mm (0.031"), from Speedline Technologies- Electrovert and Accel. See this paper under Accel: "High Reliability Underfill Performance through Proper Flip-Chip D
Electronics Forum | Mon Oct 29 15:18:31 EST 2001 | Chris
I am attaching bare die using conductive epoxy. Thanks, Chris
Electronics Forum | Thu Nov 26 03:59:50 EST 1998 | Chi-Ting Chen
I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cause
Electronics Forum | Thu Nov 26 06:07:40 EST 1998 | Earl Moon
| I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cau
