Electronics Forum: die attach adhesive (Page 2 of 18)

Re: Heatsinks for surface mount devices - adhesive alternative!

Electronics Forum | Tue May 25 10:56:12 EDT 1999 | John Thorup

| | | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the bo

Need a non-static generating adhesive transfer material

Electronics Forum | Thu Mar 27 16:40:45 EDT 2008 | slthomas

(or just some static-safe foam tape) I need to seal a wire terminal block to a board for conformal coating purposes. Currently we glue it to a shim and glue the shim to the board (yuck), but I want to use die cut gaskets if I can make it cost effec

Need a non-static generating adhesive transfer material

Electronics Forum | Sat Mar 29 12:05:09 EDT 2008 | davef

Install a gasket made of a non-esd safe material that can be die cut at a station equiped with an ionizer.

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Wed Feb 21 20:01:39 EST 2001 | davef

I�m unclear about the intent of your question, but I�ll take a pass at it regardless. I second the previous poster's commets. [Ya, that's the ticket.] Most chip attach adhesives should not be cured at typical reflow profile temperatures. Check yo

Where can i find Chip-on-board Forum?

Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest

Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te

tape and reel machine

Electronics Forum | Thu Oct 11 13:37:35 EDT 2001 | Stefan

The pressure sensitive tape is used as an alternative to heat sealed cover tape. It works usually quite well and is easily applied by the taping machine, but it can create some problems in the tape feeder. In the Surftape, Cal is referring to, the c

About the PCB gold finger contamination.

Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe

Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure

Adhesive Dispense Equipment

Electronics Forum | Mon Oct 29 15:18:31 EST 2001 | Chris

I am attaching bare die using conductive epoxy. Thanks, Chris

Adhesive Dispense Equipment

Electronics Forum | Tue Oct 30 22:08:45 EST 2001 | flynhi34

I have not looked into eutectic die attach. My dies are about .012" square and could get smaller. Currently using a Epoxytech conductive adhesive. I am going to go out and look at equipment and build samples. Some vendores state they can do .010"

Adhesive Dispense Equipment

Electronics Forum | Tue Oct 30 17:16:24 EST 2001 | seand

Hello Chris, If you could humor me, what are the limiting factors forcing your dot size to .010"? What is the die size that you are placing? What are the accuracy tolerances? Was eutectic die attach never an option for this bare die? Have you de


die attach adhesive searches for Companies, Equipment, Machines, Suppliers & Information