Electronics Forum | Tue Jan 10 12:53:16 EST 2006 | muse95
There is a tape test from IPC in their TM-650 spec that can be downloaded for free from the ipc website. It will test for gold adhesion to the underlying nickel. Section 2.4.1E, I believe. It is quite simple to perform.
Electronics Forum | Tue Aug 23 09:02:12 EDT 2005 | Bob R.
There are several methods in IPC-TM-650 depending on whether you're testing for the effect of flux residues or board cleanliness. They're available for free download here: http://www.ipc.org/contentpage.asp?PageID=4.1.0.1.1.6
Electronics Forum | Thu Oct 02 10:55:37 EDT 2003 | caldon
Brad- The Spec can be downloaded free from IPC at http://www.smema.org/smema1.2.pdf (or IPC.org search for SMEMA Standards). As per Conveyor edge clearance should be .187" or 4.7mm. Regards, Cal Communications Test Design, Inc. www.ctdi.com
Electronics Forum | Fri Aug 24 07:49:37 EDT 2001 | caldon
Depending on how old your through hole equipment is it should be SMEMA compatible. A copy of the SMEMA wiring diagram and protocalls can be down loaded from the IPC web site Under downloadable Doccuments SMEMA Standards. SMEMA : http://www.ipc.org/ht
Electronics Forum | Wed Sep 18 15:58:47 EDT 2002 | JS
You can find the spec on the IPC website in download format. Just type "Smema standards" in your search box and go Regards
Electronics Forum | Fri Nov 05 12:25:42 EDT 2010 | deanm
I think you are right. According to IPC-7526 section 6.2 says that using compressed air to blow out paste will damage the stencil, especially between fine pitch apertures. It can also broadcast solder paste onto other surfaces or personnel. I recomm
Electronics Forum | Fri Apr 20 13:55:09 EDT 2001 | kawiederhold
Hey Dougie, If you go to IPC.ORG and click on the on-line resources and databases, then on the "free downloads" link, the second or third document "for free" is the IPC-TM-650 in its entirety. It does discuss the test you are looking for! Have fun
Electronics Forum | Fri Sep 21 16:00:55 EDT 2001 | davef
In addition to providing guidelines for BGA inspection and repair, IPC-7095 also addresses reliability issues associated with BGA: 7095, �Design and Assembly Process Implementation for BGA's� Your boards should be assembled in conformance with: *
Electronics Forum | Thu Nov 10 20:14:44 EST 2005 | davef
FREE DOWNLOAD - SMEMA3.1 - Fiducial Mark Standard http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=TOCFRAME&ARGUMENTS=-N,-N,-A,-A,-N50
Electronics Forum | Tue Dec 09 18:11:06 EST 2008 | davef
Just to keep this up in the air, go to the http://www.ipc.org free download section. There is a contract assembler questionaire that could be a good starting point for what you seek to accopmlish. Check it, get back to us and maybe we can use that as
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