Electronics Forum | Thu Dec 02 23:43:23 EST 1999 | Kantesh Doss
We have a serious misalignment problem of D-Pak components (Specifically Motorola's part number MJD-3055/MJD-2955)following reflow soldering process. We are using Alpha Metals UP78 solder paste. Our reflow oven is Nitrogen inerted and our oxygen leve
Electronics Forum | Fri Nov 17 15:04:59 EST 2006 | ehess
WE have a problem with a DPAK component floating during reflow, causing it to move to the point where it affects the toe fillet. We have been using a dot of SMT epoxy to hold it secure for the moment. I have looked on many sites, but no whrere can
Electronics Forum | Tue May 31 22:40:24 EDT 2011 | bejrananda
HI All, Please kindly advice me, I have project that it has DPAK part (MPN:SUD25N15-52 E3 Plating:100% Sn matte)which locate on bottom side (1st reflow), Good wetting for 1st reflow.. but .. when I run Top side (2nd reflow).I found that this D
Electronics Forum | Thu Oct 07 17:02:07 EDT 2010 | cbroegger
Hi, this one should be good for DPAK (TO-252) : 00357992-02
Electronics Forum | Fri Jul 26 12:41:43 EDT 2013 | dontfeedphils
Check the centering force, and change it to High, if it isn't already.
Electronics Forum | Tue Sep 24 10:09:52 EDT 2013 | leigh
Windowpane your ground planes, this will prevent a lot of voiding.
Electronics Forum | Mon May 25 20:21:47 EDT 2009 | dcell_1t
Hi there: I'm having trouble to assign an adequate vision Type to dpak components in Fuji Flexa (placed by an IP3, SMD3 vision system). Currently we're using 254 but accuracy is reduced and also can be placed backwards (yes, I know... supplier packag
Electronics Forum | Fri Jul 26 11:20:33 EDT 2013 | gnus
Hi all, I'm having issues placing 7 pin DPak packages. I'm using mechanical centering with four centering phases (one for each orientation). Tool used is A24S. Machine picks up the part but will reject it when centering the part. I have measured all
Electronics Forum | Tue Aug 11 09:48:22 EDT 2015 | samputrah
We have had two jobs that have the same issues with DPAK's sliding off their pads during reflow. We tried to resolve this by placing epoxy on the side of the component to create a "dam". However this is not repeatable enough to be a quality resolutio
