Industry News | 2012-05-31 14:49:02.0
Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.
Industry News | 2015-11-01 16:14:06.0
High-mix, medium-volume contract manufacturer, EI Microcircuits specializes in high-quality design, engineering and production of PCBs used in the industrial controls, medical and government sectors. With diverse and multiple jobs running throughout the Southern Minnesota-based EMS firm’s three facilities, ensuring tight reflow soldering processes is critical to high-yield and cost-effective manufacturing. For this important assembly process, EI Microcircuits relies on ECD’s M.O.L.E.® thermal profiling and OvenRIDER® technologies.
Used SMT Equipment | Soldering - Reflow
2009 Vitronics XPM2 Reflow Oven has Left to Right. 8 heating zones and 2 cooling zones. Only in use 6 months. 208V, 3 Phase, 60 Hz. System: * 8 top and bottom forced convection heat cells and 2 top and bottom cooling cells * Overall syst
Industry News | 2017-03-01 14:41:48.0
ECD is celebrating its recent Service Excellence Award win, which marks the second consecutive such accolade for the thermal profiling and dry storage technology pioneer. The awards contest, sponsored by Circuits Assembly magazine, is voted on by customers and evaluates participants in the key areas of dependability, value, quality, responsiveness and technology. ECD won the Soldering Equipment category for the second year in a row, underscoring the effectiveness of the company’s M.O.L.E. thermal profiling systems and its robust service mindset.
Industry News | 2016-04-07 10:40:38.0
At last month’s APEX event in Las Vegas, ECD was honored with one of the electronics assembly industry’s most prestigious awards, the Service Excellence Award. Unlike other contests that are voted on by a judging panel, the Service Excellence Award has particular cachet because winners are determined based on direct responses from participants’ customers, the true authorities of a company’s performance.
M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, E
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
Industry News | 2015-11-18 18:44:38.0
BTU International today announced that it has partnered with thermal measurement innovator ECD in a joint development initiative to integrate the company’s new Recipe Generator technology directly into BTU’s Wincon furnace operating system. ECD’s Recipe Generator is currently available through ECD’s M.O.L.E. series of thermal profiling systems, and the new integrated feature will be released in early 2016 as part of BTU’s Pyramax reflow product line. The technology will be the industry’s most comprehensive recipe prediction tool to-date, due to its process settings for zone temperatures and belt speed, which take into account the convection rate -- the most significant element of heat transfer.
Built around ECD's award winning V-M.O.L.E.® Thermal Profiler, the OvenCHECKER™ system comes complete with the profiler, thermal barrier, pallet and M.O.L.E.® MAP software, making it a complete solution for reflow oven verification. OvenCHECKER™ gr
Industry News | 2001-08-02 13:39:10.0
ECD has announced that its new Guide to Quality Control of the Automated Solder Process is now available. This 16 page Guide will provide users with important information about Classic PCB Temperature Profiling as well as how to maintain a wave or reflow solder machine in "factory-new" condition.
