Parts & Supplies | Soldering - Wave
ELECTROVERT V STYLE, THICK, TITANIUM FINGER PN 3-0257-242-01-03 (EF07)
Parts & Supplies | Soldering - Wave
Looking for Electrovert Discrete I/O Board Part Number: 6-1860-184-02-1 Please contact us if you have this available 978-790-2774
New Equipment | Wave Soldering
Wave Soldering Machines - Speedline Electrovert, Vitronics Soltec, Technical Devices, Ersa, Seho Wave Soldering Machines for sale at JMW Enterprises.
Used SMT Equipment | Soldering - Wave
Please forward details and available photos Looking for 2-3 machines
Used SMT Equipment | Soldering - Wave
Speedline Electrovert Vectra 450/F Wave Soldering Machine Make: Speedline Electrovert Model: 450/F Year: 1999 Lead-Free Convection Bottom-Side Preheat (2 Zones) No-Clean Flux Board Grip & L Fingers SW: V3.27 Complete & Operational
New Equipment | Wave Soldering
The Ideal Wave Soldering System for Low-to-Medium Volume Lead-free Pproduction. The award-winning ELECTROVERT VectraES wave soldering system features exceptional system-wide accessibility, an advanced control system and innovative sub-system technol
The OmniMax reflow soldering system is designed to deliver maximum thermal performance combined with process capability and control. IsoThermal™ Chamber Technology The OmniMax reflow soldering system is designed to deliver maximum thermal per
Used SMT Equipment | Soldering - Wave
Electrovert Wave Soldering Machine Model: Vectra 450/F Vintage: 2001 Leaded - Pot Full Of 63/37 Solder 3 Bottom Side Preheat (2 Convection + 1 IR) 1 Top Side IR Preheat Power: 3 x 480V Complete & Operational
Industry News | 2022-11-21 15:50:26.0
ITW EAE is releasing a new feature for the Electrovert Wave Soldering machines that provides automatic adjustment of the laminar wave flow to match the board velocity. To fully optimize the flow dynamics of the laminar wave, the velocity of the PCB needs to equal the flow of the solder over the weir of the exit wing. When the wave flow is fully optimized, the PCB 'peels' away from the solder which minimizes the opportunity for bridging defects to occur.