Electronics Forum | Fri Nov 27 02:11:17 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Mon Apr 01 23:16:44 EST 2002 | dwoon
Hi, Heard about flux encapsulant - a compression-flow flux and underfill product for flip chip assembly. It eliminates the need for a separate underfill operation. Does anyone has experience in actual production run? What is the possible effect for
Electronics Forum | Fri Apr 01 17:45:31 EDT 2011 | smt_guy
thanks for all your replies. we tried running our beta runs and have lots of issues. first our molding process which was set to 450'F temp at 1200 PSI smashed the circuit card components and penetrated the epoxy compound we used to encapsulate the C
Electronics Forum | Fri Nov 27 08:07:50 EST 1998 | Earl Moon
| | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is
Electronics Forum | Sun Apr 21 19:56:57 EDT 2002 | francis khoo
Hello Pete, Very true about the heel fillet. Looks like the pad at pcb has to be designed such that the pad should extend at heel but short at toe. About the encapsulation. I can understand the requirements. Can you provide me with a more detail proc
Electronics Forum | Wed Feb 20 13:56:16 EST 2008 | patrickbruneel
Tony, Conformal coating will protect the board from outside moisture but will also encapsulate Ionics and moisture when present on the board.
Electronics Forum | Wed Jan 19 19:47:16 EST 2005 | davef
It depends. Let's focus. The basic versions of COB are: * Semiconductor die that you place on a glued board surface, wire bond, and then encapsulate. [The crazy uncle of the COB process, accounting for 90% of the placements.] * Semiconduct die tha
Electronics Forum | Fri Dec 16 11:21:18 EST 2005 | patrickbruneel
Steve, Water-soluble fluxes are per definition very corrosive and need to be cleaned (read the data sheet) Encapsulation will prevent humidity reaching the water-soluble acids but will not prevent reducing the metals the flux is in contact with to m
Electronics Forum | Thu Oct 26 19:22:06 EDT 2006 | fredericksr
Hi, I am looking for anyone that uses the Henkel/Loctite FP4460 glob top encapsulant. We use considerably less than the minimum order quantity during the product's 6 month shelf life and could really use a reseller or company that may be intere
Electronics Forum | Tue May 22 11:08:12 EDT 2012 | patrickbruneel
It sound like this connector is a serious head sink which can be solved with more preheat or slower conveyer speed. It might also be a combination of the heat sinking capability of the connector together with encapsulated flux underneath the connecto
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