Electronics Forum | Wed May 22 19:10:47 EDT 2013 | anvil1021
We do a lot of these devices and I guess I am not familiar the term "Dry Solder". The QFN device is not designed to have a drain hole, but needs to have thermal vias to control heat in most cases. We have used every possible gnd pad design and modifi
Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr
Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-
Electronics Forum | Fri Jan 31 10:04:14 EST 2020 | emeto
Jinesh, My initial suggestion is you have too much solder past. Please try to reflow a few of these parts without solder paste. Colse aperture, put some tacky flux on this part location and give it a try. I bet you will not see any voiding.
Electronics Forum | Mon Nov 09 07:21:02 EST 2009 | CL
Good Morning, I have seen many posts regarding BGA voiding being excessive and what can be done to better the condition. I have a customer that has an assembly that we have had a diufficult time with. We have spent a lot of time debugging the proces
Electronics Forum | Wed Sep 21 16:25:43 EDT 2005 | GS
IPC-7525 tells you how to make stencil apertures for BGA IPC-7095 tells you how much should be the paste volume in order to get a reliable BGA solder joint. How are your PCB finisced? (HASL, ENIG, OSP, etc?) In case of not HASL, it could be necessa
Electronics Forum | Wed Nov 12 18:58:19 EST 2008 | joeherz
I attended SMTA's copper dissolution webinar this morning and am almost convinced that this is not our problem. Still planning to do cross sections to verify but our dwell times are nowhere near levels that could cause a problem assuming good platin
Electronics Forum | Tue Aug 31 22:03:30 EDT 2004 | KEN
If you have control over your design (as in an OEM) ENTEK can be a managable alternative. IF your like me (a CM), you get one of everything ever imagined. There has been much ado with ENTEK. Not every product is apropriate. For instance I have cu
Electronics Forum | Fri Jan 06 00:03:10 EST 2023 | SMTA-64419298
Hello Evtimov, sorry...just saw post as I was looking through list...a bit late. I don't know if you ever got your answer. IPC-4552A covers EniG finishes and suggested shelf life. I've referred to these doc's quite a bit. Good spec's ! Yes, I beli
Electronics Forum | Fri Sep 13 09:16:36 EDT 2002 | bmulcahy
Hi dave, Only back in the forum today to see your query so here goes (1) VIA ,PTH holes -- we found that because the amount of gold being plated is generally less that the amount of HASL that holes can be physically wider. This then (pacticularly o
Electronics Forum | Mon Jul 21 08:34:44 EDT 2003 | Don Bell
Blow holes/ pin holes in solder joints are the result of multiple root causes. Suggested analysis might look like this; 1) What method of solder preservation is used on the bare board. (hasl,enig, osp, etc.) HASL can leave unwanted flux residues,
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