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IWLPC Best Papers Announced

Industry News | 2014-01-21 18:29:32.0

SMTA and Chip Scale Review magazine, co-organizers of the International Wafer-Level Packaging Conference (IWLPC), announced the Best of Conference papers from the event held November 5-7, 2013 in San Jose.

Surface Mount Technology Association (SMTA)

Eutect GmbH

Industry Directory | Manufacturer

Soldering and joining systems.

Kapp Electric Eutectic - Tin Lead Silver Solder for Electronics ( solid or Rosin cored )

Kapp Electric Eutectic - Tin Lead Silver Solder for Electronics ( solid or Rosin cored )

New Equipment | Solder Materials

With a composition of 62% Tin / 36% Lead / 2% Silver, Kapp Electric Eutectic is a cost effective eutectic electrical/electronic solder where Lead is permissible. Silver increases the strength and vibration resistance of the joint in higher stress app

Kapp Alloy & Wire, Inc

BGA Rework & X-Ray

New Equipment |  

BGA component types, characteristics, eutectic and non-eutectic solder, ceramics, determination of profiles, equipment, BGA removal, site preparation, reballing, soldering , cleaning etc.

C-G Technology Marketing

DESOLDERING TOOLS: SC-400A

DESOLDERING TOOLS: SC-400A

New Equipment | Other

Double Pump for a quick and powerful suction and easy clean up. Designed For SMT and Thru-hole Desoldering of Eutectic or Lead Free Solders.

DEN-ON INSTRUMENTS CO., LTD.

BGA Socketing Systems

New Equipment |  

Three solutions for virtually any application. BGA Socket Adapter Systems featuring eutectic solder balls and footprints which match BGA device are designed for high volume production applications. Pop-Top� Socket Adapter Systems features integral he

Advanced Interconnections Corporation

Quick-Turn BGA Reballing Services

New Equipment |  

We do reballing services for BGA reballing as follow: (1) Eutectic-ball BGA (2) Gigh-temp-ball CBGA (3) Lead-Free-ball BGA. We offer reliable, quick-turn services in as little as 24 hours.

Sparqtron Corporation

China Beijing TORCH RS220 Hydrogen Vacuum Eutectic Furnace IGBT Vacuum Eutectic Soldering Machine

New Equipment |  

China Beijing TORCH RS220 Hydrogen Vacuum eutectic furnace IGBT Vacuum Eutectic Soldering Machine RS220 Vacuum eutectic furnace Function Introduction: 1. TORCH promotes a new Vacuum Reflow Oven in RS series which is the third generation o

Beijing Technology Company

China Beijing TORCH RS220 Hydrogen Vacuum Eutectic Furnace IGBT Vacuum Eutectic Soldering Machine

New Equipment |  

China Beijing TORCH RS220 Hydrogen Vacuum eutectic furnace IGBT Vacuum Eutectic Soldering Machine RS220 Vacuum eutectic furnace Function Introduction: 1. TORCH promotes a new Vacuum Reflow Oven in RS series which is the third generation o

Beijing Technology Company

KappAloy9™ - Solder for Aluminum to Aluminum, Copper and Brass

KappAloy9™ - Solder for Aluminum to Aluminum, Copper and Brass

New Equipment | Solder Materials

KappAloy9™ 91% Tin / 9% Zinc solder is the eutectic standard solder for Aluminum to Aluminum and/or Copper. It is used extensively in oven soldering and other automated soldering systems. Learn more and order: http://www.solderdirect.com/all-produc

Solder Direct


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