Electronics Forum | Fri Sep 24 11:08:13 EDT 2004 | davef
We're not sure what you mean by temperature sensitive components. From an assembly process stand-point, every component we use is temperature sensitive to one level or another. More specifically, some of our products use polyphenylene sulfide (PPS)
Electronics Forum | Fri Sep 08 11:29:40 EDT 2006 | GPP
James, What type of profile are you using. Ramp-to-Spike, Ramp-Short Soak-Spike, or Long-Low Spike? I had a similar problem in a past life - random skews on chip components - and got rid of it by converting to Ramp-to-Spike (the old profile was R
Electronics Forum | Tue May 28 10:59:56 EDT 2002 | Por
All Could anybody help to let me know the effect of AXAREL 36 (Petroferm Inc.) on electronic device for cleaning PCBA application. I am process engineer and currently using Prozone solvent and Axarel 32 to be cleaning solder for smear board cleani
Electronics Forum | Mon Sep 11 14:58:16 EDT 2006 | cuculi54986@yahoo.com
Steve, Let me guess, you were using this one: http://www.panasonic.com/industrial/components/pdf/abd0000ce10.pdf That part sucks. They have a newer part number that is supposedly "reflow-friendly". Unfortunately, I can't convince our quality de
Electronics Forum | Tue Apr 12 22:23:05 EDT 2005 | Al
The way we do this, is to tape a transparent film to the PCB. The printers and chip shooters can read fiducials no problems. Once it has been run through SMT, simply remove the tranparency film and the PCB is ready for use, no mess no cleaning and yo
Electronics Forum | Tue Feb 12 05:47:29 EST 2002 | Roy Barton
To Dave F. Thanks for your comments. I should point out that I am not well versed in SMT, I am more of a thick film and chip man. However I will look into your leads. I will try and find out more about the Quad equipment. I am very wary in getting
Electronics Forum | Sun Dec 23 08:41:04 EST 2001 | dwoon
Does anyone has experience in ACF (anisotropic conductive film) process? What is the typical bonding pressure/force/temperature for FCOG (flip chip on glass)? Will the glass crack when a high pressure applied during flip chip placement? Thanks and
Electronics Forum | Fri May 12 09:24:45 EDT 2000 | Ashok Dhawan
I need to install two SMD chips (0805) at one location. I refered to IPC-HDBK-001, fIG 6-24. When I solder the chips side by side, the ceramic side which is placed againgst solder pad- is already touching the solder. While I complete the solder joint
Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam
| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run
Electronics Forum | Sat Jun 12 08:50:41 EDT 1999 | Dave F
| I am trying to find out as much information as possible relating to conductive inks. | | If anyone out there is using them please give some advice. | | 1) How are you curing the ink? | 2) What type of substrates are you using and who supplies
