Industry News | 2019-08-12 20:10:19.0
IPC's Study of Quality Benchmarks for Electronics Assembly 2019 is now available. This global study provides valuable benchmarking data to electronics assembly companies interested in comparing their quality measurements to those of the industry worldwide.
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2011-07-22 23:48:37.0
DEK introduced two breakthrough technologies, ProActiv and Nano-ProTek stencil coating, to customers in Chengdu last week.
Technical Library | 2010-03-04 18:11:53.0
While the electronics manufacturing industry has been occupied with the challenge of RoHS compliance and with it, Pb-free soldering, established trends of increasing functionality and miniaturization have continued. The increasing use of ultra-fine pitch and area-array devices presents challenges in both printing and flux technology. With the decrease in both the size and the pitch of said components, new problems may arise, such as head-in-pillow and graping defects
Technical Library | 1999-04-15 06:56:07.0
Solder paste is a seemingly simple material that forms one of the foundations of the surface mount assembly operation. If the solder paste does not do its job correctly then first pass yield will be severely reduced.
Technical Library | 2018-07-18 16:28:26.0
Reduction of first pass defects in the SMT assembly process minimizes cost, assembly time and improves reliability. These three areas, cost, delivery and reliability determine manufacturing yields and are key in maintaining a successful and profitable assembly process. It is commonly accepted that the solder paste printing process causes the highest percentage of yield challenges in the SMT assembly process. As form factor continues to get smaller, the challenge to obtain 100% yield becomes more difficult.This paper will identify defects affecting SMT yields in the printing process and discuss their Root Cause. Outer layer copper weight and surface treatment will also be addressed as to their effect on printability. Experiments using leadless and emerging components will be studied and root cause analysis will be presented
Used SMT Equipment | Adhesive Dispensers
TH-2004KG T&H silicon dispenser Applicable rang: Applications requiring a larger volume of pneumatic pressure such as when dispensing silicone from cartridges, glue from tubes with an auto tube system, the unit exhausts a greater volume of air, wh
QRP manufactures gloves and fingercots for use in the electronics industry: conductive gloves and fingercots, anti-static fingercots, static dissipative gloves and fingercots.
Industry Directory | Consultant / Service Provider / Manufacturer
Designer, manufacturer and assembler of quickturn protoype to high volume production of flex circuits, rigid-flex and HDI flex circuits
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