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Now Available: Placing Force Measurement Option on FLX2011

Industry News | 2012-03-30 13:42:24.0

New technologies such as package on package (PoP) component assembly or bare die assembly on COB applications, as well as the optimization of material consumption demands for increased knowledge of the actual placement forces.

ESSEMTEC AG

Essemtec AG Opens Essemtec Benelux

Industry News | 2009-04-21 13:02:34.0

Essemtec Switzerland has announced that as of April 2009, its new subsidiary Essemtec Benelux will be responsible for all activities of the Swiss SMT equipment supplier regarding Belgium, Netherlands and Luxembourg. The first official presentation will be at the Electronics & Automation exhibition in Utrecht (27th � 29th of May 2009).

ESSEMTEC AG

ESSEMTEC to Highlight Key Products and Technologies at APEX 2009

Industry News | 2009-03-27 09:58:30.0

Essemtec announces that it will feature its innovative products in booth 243 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas. These machines will be offered at Special Show Pricing, so be sure to stop by the booth.

ESSEMTEC AG

Essemtec Establishes a Subsidiary in Poland

Industry News | 2011-03-29 13:45:57.0

Essemtec, the Swiss manufacturer of production systems for electronics, strengthened its market presence in Eastern Europe by founding a new subsidiary in Warsaw, Poland in February 2011. Managing Director is Mirosław Borkowski.

ESSEMTEC AG

Essemtec Introduces FLX2010C System with Vacuum Downholder for Flex Board Component Placement

Industry News | 2008-09-08 03:46:39.0

Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it has worked with leading suppliers of die bonders to develop a highly economical solution for the efficient placement of special components on film or flex boards, providing many benefits to the users.

ESSEMTEC AG

Essemtec Premiers New Pick-and-Place System for 3D-MID

Industry News | 2008-11-18 17:22:43.0

Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.

ESSEMTEC AG

Essemtec Introduces CDS6200 with Two Jet Dispenser Systems

Industry News | 2009-03-06 00:18:11.0

Essemtec, the leading manufacturer of SMT production machines, introduces the CDS6200 with two Jet dispensers. The jet-dispensing technology allows proportioning of various media at a large number of points. Because the materials to be dispensed have various specific characteristics, which partially depend on environmental conditions, selecting valves that are suitable for particular materials are necessary. CDS6200 with two Jet dispensers provides the technology to do this.

ESSEMTEC AG

The Daily Search for New Ideas and Solutions Poland-based PP-Elektronix specializes in manufacturing unusual devices

Industry News | 2012-10-29 13:09:31.0

, PP-Elektronix has become one of the leading electronics manufacturers in Poland. Maintaining a continuous high quality level has made its name known throughout Europe, America and Asia.

ESSEMTEC AG

Manufacturing LED Products Requires Holistic Concepts

Industry News | 2013-12-18 08:20:08.0

Building electronic solutions using LEDs brings significant advantages regarding flexibility in design and time-to-market. Building such products, however, requires expansive knowhow and high-quality equipment for all steps from circuit design to assembly and testing. The UK company SafeTest Ltd. has all required experience, knowledge and equipment under one roof. Assembly machines from Essemtec Switzerland enable SafeTest to quickly realize customer-specific LED applications of highest Quality.

ESSEMTEC AG

advice on used PnP

Electronics Forum | Mon Jun 29 15:33:28 EDT 2020 | jmelson

WOW, thanks for the documents, this will REALLY help selection. It looks like I want the FLX2011CV, that makes it a lot easier to set up and not have to reach into the machine to load and unload boards. The machine footprint is really compact, 10 m


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