Electronics Forum | Tue Apr 14 10:21:11 EDT 1998 | EFData
| Does that part still have a heat sink built into it or is it the plastic package? | Justin Originally, we also thought the heat sink may be causing problems, so we conducted tests on both the plastic package and heat sink versions. Nothing conclusi
Electronics Forum | Wed Nov 10 02:20:07 EST 1999 | Marc
The padsfor large heat sinks are being designed on our boards with large copper ground planes surrounding them by our engineers. I am having great difficulty keeping the reflow temperature below 230 degrees in order for the temperature of the copper
Electronics Forum | Thu Jun 24 14:14:25 EDT 1999 | Chris
| Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembl
Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq
Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach
Electronics Forum | Mon Dec 18 09:42:44 EST 2000 | floydl
When designing high performance circuit boards are there methods that can be used to improve thermal conductivity without using heat sinks? Can boards be designed in a way that reduces or eliminates the need for sinks?
Electronics Forum | Mon Oct 21 12:18:22 EDT 2002 | John S
We're looking at a new assembly that will require an SMT heat sink. Can anyone recommend potential vendors for this part? It is new to us, so we're having to start from scratch. Thanks John
Electronics Forum | Sun Aug 01 11:27:40 EDT 2004 | haran
What is the best epoxy attachment method for Heat Sink?The operator always miss the solvent dispensing application prior to epoxy dispense which cause the heatsink falling off at customer site as well as in the factory?Any advise?
Electronics Forum | Fri Mar 24 14:06:07 EST 2006 | mdemos1
Hi. We are designing in a 128 pin LQFP that has a heat sink in the center of the package. The size of this is 7.44 by 7.55 mm. Can anyone recommend what pad size should be on the board for this? How about stencil aperture/pattern? Thanks, Mike.
Electronics Forum | Fri Mar 19 18:07:24 EDT 2010 | davef
That's how it's supposed to work, but is working correctly on the components that are loosing heat sinks for you? We have two choices: * Poor solderability of either the component or the heat sink ... OR * Wrong solder preform material
Electronics Forum | Tue Feb 15 19:54:48 EST 2000 | Clarissa Ortner
I am supposed to heatsink a Temp sensor with leads .9-1.1mm(.035--43"). I have found on our engineering units that the smallest heat sink I have found commercially is still too heavy for the leads and unless the operators use exxxxtreme care the wei
