Electronics Forum | Fri Apr 30 10:34:16 EDT 1999 | Ryan Jennens
Mornin! We just had vendor in here pitching a "low-temperature rework system" which was intriguing, but too expensive. He did get me to thinking though, beyond heating ceramic caps before hand-soldering them, it seems like it would be advantag
Electronics Forum | Tue Aug 05 18:04:34 EDT 2003 | D
more heat heat, more time in wave
Electronics Forum | Wed Apr 19 03:58:43 EDT 2006 | slaine
Usually too much heat or heat applied for too long
Electronics Forum | Mon Sep 13 05:14:06 EDT 2021 | compit
A large pad nearby receives heat - the resistor pads heat up unevenly ?
Electronics Forum | Thu Jun 17 17:04:43 EDT 1999 | Doug Batten
Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembly
Electronics Forum | Wed Sep 30 11:42:45 EDT 1998 | Ray N. Lopez Mata
I am looking for a material which may be used to deflect heat / shield a component from heat. The component would be exposed to the heat during the card reflow process. I would need the material to be of such a nature that I could form a cover by
Electronics Forum | Wed Nov 28 07:41:10 EST 2007 | davef
DevGru: Questions are: * What steps do you recommend taking to "watch out for the exothermic heat from the curing?" * What are typical temperatures for exothermic heat from the curing? * What is the duration of such temperatures? * Do epoxy suppliers
Electronics Forum | Fri Mar 27 12:59:22 EDT 2015 | ppcbs
That is a strange task. I must ask what is the purpose? When performing BGA Rework the goal is to recreate the manufacturing process of using the reflow oven. It is important to have even heat of the BGA and PCB from top to bottom. Using top heat o
Electronics Forum | Fri Aug 12 09:49:19 EDT 2016 | deanm
In general, smaller objects heat up faster than larger objects because they are lower mass. For example if you heat up one liter of water in pan and two liters of water in another pan with the same heat energy applied, the smaller mass will heat up f
Electronics Forum | Wed Oct 10 12:22:08 EDT 2001 | Kevin
Cal, There are several suppliers of cover tape materials that do not require heat to activate the adhesive. 3M and Advantek are likely the leaders. There are relatively few T&R machines that can handle both heat and non-heat applications - as Chri
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