Electronics Forum | Tue Oct 12 08:48:16 EDT 1999 | Carol Zhang
| | I have a board, 4 spacers needed to be soldered on the board | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, there wi
Electronics Forum | Fri Oct 08 08:26:03 EDT 1999 | Carol Zhang
| | | I have a board, 4 spacers needed to be soldered on the board | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, ther
Electronics Forum | Thu Oct 07 16:57:02 EDT 1999 | Glenn Robertson
| | I have a board, 4 spacers needed to be soldered on the board | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, there wi
Electronics Forum | Fri Oct 08 10:08:48 EDT 1999 | Glenn Robertson
| | | | I have a board, 4 spacers needed to be soldered on the board | | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first,
Electronics Forum | Tue Dec 12 17:34:39 EST 2017 | spoiltforchoice
A pattern emerges, but really I think it means plan/optimise for your day/week not a single job. Our machine uses 10's, this means there's a significant chunk of the feeder that is not easily accessible if something like a brass shim gets stuck or f
Electronics Forum | Mon Dec 11 19:28:51 EST 2017 | spoiltforchoice
That's not really the point of dual lane feeders. As a general rule having a dual lane 8mm feeder means the machines "slots" are actually 16mm, dual lanes on a 8mm feeder helps keep the overall lane density of a machine higher, its much easier to bui
Electronics Forum | Wed Apr 23 09:38:05 EDT 2014 | rgduval
Get in touch with your paste manufacturer. They should have a data base of different oven types/zones, and can give you "baseline" settings for a medium thermal density board that has been proven to work well with their paste. After that, it sounds
Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382
Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3
Electronics Forum | Wed Apr 20 12:22:51 EDT 2005 | jdengler
Russ is correct, but you may have variations between board density types also. Some ovens may be able to handle low density boards with no spacing, but need a zone's worth of spacing for high density boards. Other ovens don't need any spacing for a
Electronics Forum | Fri Sep 22 07:02:12 EDT 2006 | basem
Thanks Rob. Our concern is placing tiny components side by side at a minimum pitch, along with fairly large BGAs and TSOP2, which are themselves, having small to fine pitch leads. yes, accuracy in placement in our application is crucial, yet, what i
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