Electronics Forum | Wed Aug 23 17:43:42 EDT 2023 | calebcsmt
Support bars, so essentially the board is sitting ontop of beams that make a table. Fully supported with no soft spots
Electronics Forum | Wed Aug 21 13:28:20 EDT 2019 | ameenullakhan
And what is the solder paste selection recommendation for the same. 1. Water soluble ( organic based flux solder based ) 2. No clean ( rosin or resin based solder paste ) customer is suggesting water soluble chemistry , which is having lot hot an
Electronics Forum | Thu Jan 27 11:23:45 EST 2005 | russ
Well first off I wouldn't evaluate paste for a wave process. I would use solder bar instead. Flux - top side fillets and no shorting on the solder side, does it clean well after processing if using water soluble flux. How wide is the process win
Electronics Forum | Wed Sep 18 06:53:05 EDT 2002 | CH
1) For solder short, pls check the paste height. Too much vol will cause short. For 15 mils use 5 mils thickness stencil if possible. Check profile preheat time to prevent hot slumpof the paste. 2) type 4 powder will be better for 15 mils pit
Electronics Forum | Tue Oct 30 10:54:37 EST 2001 | slthomas
Hey, Preacher, choir here. Unfortunately I didn't get to make the call here (hot boards, new product, same ol' same ol'), but I dam* well am looking for future (print) backup to assist in persuading the bottom line guys that it's cheaper to wait for
Electronics Forum | Tue Jun 19 12:26:38 EDT 2007 | billr73
We will be hand soldering a small number of PCBs per week (both through hole and SMT) using a water soluble flux. We will be using both standard leaded and lead free solder. The completed assemblies be hand washed in a sink using hot water. Do we
Electronics Forum | Fri Jan 08 19:47:55 EST 1999 | Kwang-Seong Choi
| | HI! I am a package engineer in Korea. I have some reasons | | to desolder excessive solder at the lead of TSOP and TSOJ | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | | Does
Electronics Forum | Wed Dec 11 06:34:24 EST 2019 | ameenullakhan
Hi Everyone, Reducing the top heaters around 10 deg each at last 3 zones of reflow oven. Helped us in achieved little lesser temperature at top connection of the CCGA. And we didn't face any bent. Bridging : Reducing the stencil aperture , has wor
Electronics Forum | Sun Jan 10 08:44:32 EST 1999 | Dave F
| | | HI! I am a package engineer in Korea. I have some reasons | | | to desolder excessive solder at the lead of TSOP and TSOJ | | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. |
Electronics Forum | Sat Feb 05 09:08:18 EST 2000 | Dave F
Casimir: Let me expand on something that I said in my response to your thread on ionic testing. Generally, no-clean people don�t use ROSE testing as part of their process control, because the ROSE test is essentially washing your board in DI/IPA �
