Industry News | 2001-07-13 13:03:13.0
New, versatile universal tooling for MPM AP Series and Ultraprint 2000 printers makes setup simple, repeatable, and fast. Designed to retrofit directly into most existing printers in these models, JNJ's UTP-1100 universal tooling is ideal for double-sided boards, because it features over 1,000 interchangeable support pin locations to effectively accommodate densely-populated circuit assemblies.
Industry News | 2012-08-23 11:35:21.0
BTU International (Nasdaq: BTUI),today announced that it will exhibit in Booth L004 at the upcoming International Touch Panel and Optical Film Exhibition
Industry News | 2013-06-28 12:20:07.0
Bentek Solars today announced the extension of their supply agreement and first customer shipments of the Bentek Breaker Universal Safety System (BUSS) and ungrounded string combiners. Bentek will continue to supply a range of large-scale Combiners, Circuit Breaker Recombiners, DC Disconnect Safety Systems and accessories to Borrego Solar for use on its PV solar systems.
Industry News | 2004-05-24 17:45:54.0
The new devices are designed for low-side operation in synchronous buck (single- and multi-phase configurations) dc to dc converters.
Industry News | 2005-04-26 15:48:02.0
New family of high-threshold, low on-resistance power MOSFETs for automotive and other high-current, high-temperature applications was issued by Siliconix.
Industry News | 2003-10-15 13:56:33.0
Automates New Range of Circuit Types
Industry News | 2005-04-28 12:05:17.0
Offer On-Resistance Down to 1.2 Ohms in SC-70 and SOT-23 Packages
Industry News | 2011-12-12 16:51:50.0
Green Lighting Shanghai 2012, co-organized by the China Solid State Lighting Alliance and Reed Exhibitions, will take place between April 25-27, 2012 at the Shanghai World Expo Exhibition and Convention Center. Spanning over 100 million sqm, the show is expected to attract more than 200 of the leading companies in the trade, together with 5,000 trade visitors.
Industry News | 2014-08-04 05:46:06.0
New tool features detailed data recording and analysis for optimized flash solutions
Industry News | 2003-06-11 13:37:07.0
With efficiencies better or comparable to competing implementations in the MLF/QFN/Power Block packages, these new devices in the LITTLE FOOT SO 16 feature a 38% or smaller standard footprint, simplifying design, assembly, soldering, and layout.
