Electronics Forum: j-std (Page 2 of 60)

solderability test

Electronics Forum | Fri Mar 01 17:03:15 EST 2002 | davef

J-STD-001 states the requirements for determining and preserving solderability. J-STD-002 defines the proper test methods and equipment.

J-STD-001 Training

Electronics Forum | Thu Aug 28 12:43:01 EDT 2003 | Bob Doetzer

My company is an IPC Master site and we will come to your facility to certify your operators to the J-STD-001C requirments. Please give us a call @ 919 552-3434 for more information.

Plating Integrity

Electronics Forum | Thu Jun 16 22:07:16 EDT 2005 | davef

Chris As you imply, testing board and component solderability prior to assembly is preferred. * ANSI/J-STD-002 - Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires * ANSI/J-STD-003 - Solderability Tests for Printed Boa

Lead Tinning J-STD Requirements

Electronics Forum | Tue Jul 05 20:27:54 EDT 2005 | Marcus

Having trouble identifying J-STD requirement on lead tinning. How far up to the cermaic package can you go?

Lead Tinning J-STD Requirements

Electronics Forum | Wed Jul 06 07:02:27 EDT 2005 | davef

Try: * A-610D, 6.3 � Wire / Lead Preparation - Tinning * J-STD-001D, [There is probably something. We'll look later.]

Baking of MSD devices

Electronics Forum | Wed Nov 29 20:49:14 EST 2006 | davef

According to J-STD-033B, 3.1 Requirements: The levels are determined per J-STD-020 and/or per JESD22-A113 plus reliability testing. Look here: http://www.jedec.org/download/search/jstd020c.pdf

SAC305 constituent percentages

Electronics Forum | Wed Jan 17 14:45:10 EST 2007 | ratsalad

I think you might be looking for J-STD-006. Here is a link to the table of contents: http://www.dynamixtechnology.com/docs/j-std-006as.pdf

J-STD-033B.1

Electronics Forum | Mon Feb 22 10:09:12 EST 2010 | clampron

Good Morning Nicolas, Per J-STD-033B, 5.3.3.2 states that a Dry cabintet maintained at not greater than 5% RH may be considered MBB storage. Hope this helps Chris

Vacuum sealing of MSD components

Electronics Forum | Mon Jul 15 15:02:55 EDT 2013 | island2013

In previous lives we vacuum sealed all MSD devices. Also a nitrogen chamber can be used for unsealed bags. You can check the J-STD-033 and J-STD-020A for handling of the different levels, bake times etc. Good Luck!

J STD 002 Test S source of ceramic substrate

Electronics Forum | Mon May 05 11:20:10 EDT 2014 | pankyb1261

Hi, I was wondering if there is a preferred source of the .635mm ceramic substrate specified in the J STD 002 Test S and if there is what is the typical size folks are using (3" x 3"?). Thanks, Rich


j-std searches for Companies, Equipment, Machines, Suppliers & Information

convection smt reflow ovens

High Throughput Reflow Oven
See Your 2024 IPC Certification Training Schedule for Eptac

World's Best Reflow Oven Customizable for Unique Applications
SMTAI 2024 - SMTA International

High Resolution Fast Speed Industrial Cameras.
PCB Handling Machine with CE

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
Fully Automatic BGA Rework Station

Original SMT Feeders and spares for Panasonic, Fuji , Yamaha, Juki , Samsung