Electronics Forum: j-std 033 (Page 2 of 17)

Baking of MSD devices

Electronics Forum | Wed Nov 29 20:49:14 EST 2006 | davef

According to J-STD-033B, 3.1 Requirements: The levels are determined per J-STD-020 and/or per JESD22-A113 plus reliability testing. Look here: http://www.jedec.org/download/search/jstd020c.pdf

Questions on J-STD-033A procedure (Table 4-1)

Electronics Forum | Wed Feb 15 19:27:24 EST 2006 | CW

Reviewing the J-STD-033A procedure and try to better understand Table 4-1 ... There are 3 columns for Baking Temperature & recommended Duration ... 1st one is for 125C, then for 90C, then followed by 40C ... it also specify the environmental condi

Baking MSDs in tubes?

Electronics Forum | Sun Mar 25 22:21:03 EDT 2007 | sleech

Let me explain. At 125 degrees C, the oven is above the boiling point of water. It will be vaporized and eventually be vented from the oven. However at temperatures of 90 degrees c and lower the relative humidity becomes an issue. For the life of me,

smd led storage

Electronics Forum | Thu Mar 18 12:46:20 EDT 2010 | deanm

The standard J-STD-033B.1 addresses how to store moisture sensitive components. A dry box is a good, convenient way to store MSDs, but there are other methods to consider which are outlined in the standard. Are you sure that the problems are caused

Baking BGA on reel

Electronics Forum | Mon Jul 04 09:08:41 EDT 2016 | davef

IPC/JEDEC J-STD-033B.1 Includes Amendment 1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices [http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf]

Question on J-STD-001B

Electronics Forum | Mon Mar 13 08:59:20 EST 2000 | Ashok Dhawan

I could not find a specific clause or section in J-STD-001B which can relates to special requirements in storage, packing and handling of Moisture sensitive devices per J-Std-033 / 786A /-022 . I guess the way ESD is relevant to electronics assemb

Question on J-STD-001B

Electronics Forum | Mon Mar 13 08:59:20 EST 2000 | Ashok Dhawan

I could not find a specific clause or section in J-STD-001B which can relates to special requirements in storage, packing and handling of Moisture sensitive devices per J-Std-033 / 786A /-022 . I guess the way ESD is relevant to electronics assemb

ROHS procedure's for handling PCB, Moisture sensitive dev. etc.

Electronics Forum | Thu Sep 15 22:23:36 EDT 2005 | davef

Use your board supplier recommendations Specific procedure or guidelines that need to be followed for handling Moisture Sensitive Devices => J-STD-020 & J-STD-033 Is there any paste height/volume requirement for a lead-free process? => You need to

What does MSL 4 on a component package means?

Electronics Forum | Thu Jan 03 08:01:23 EST 2002 | davef

In addition to a previous poster's comments, you many want to understand moisture sensitive components better. Start with: * J-STD-020 and J-STD-033. Download them here: http://www.jedec.org/download/default.cfm * �Moisture Sensitive Components� R

MS Level 6

Electronics Forum | Wed Jun 20 21:58:37 EDT 2001 | fmonette

Dave, if you have a level 6 then you have no other option then to bake it and reflow before it exceeds the specified floor life. For more details check out the joint IPC/JEDEC standard J-STD-033. It can be downloaded for free at http://www.jedec.org.


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