Industry News: jan. (Page 2 of 27)

Pulse Offers Highest Power Density SMT Planar Transformer

Industry News | 2003-01-24 09:07:53.0

For Industrial, Telecom and Datacom Use

SMTnet

The Electronics Industry Loses a Consummate Professional

Industry News | 2009-09-26 15:37:45.0

Barry O’Brien died on Sunday, September 20, 2009 while bike riding. Barry covered the Ohio territory for Horizon Sales, a manufacturer’s representative corporation supplying machinery and supplies to the electronics industry.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Three Long-time IPC Volunteers Receive Dieter Bergman IPC Fellowship Award

Industry News | 2021-03-12 04:48:20.0

Three IPC volunteers who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts, were presented with Dieter Bergman IPC Fellowship awards at IPC APEX EXPO 2021. Michael Ford, Jan Pedersen, and Peter Tranitz were chosen as award recipients because they embody the work ethic and spirit of the late Dieter Bergman, a pioneer and industry icon. They will bestow Dieter Bergman Memorial Scholarship awards on the university or college of their choice.

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference (IWLPC) Concludes Successfully

Industry News | 2010-10-20 21:21:00.0

The SMTA and Chip Scale Review magazine are pleased to announce the 7th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success. The IWLPC was held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

Vardaman to Keynote IPC Optoelectronics Conference

Industry News | 2002-04-25 09:18:17.0

Will Discuss Optoelectronics Manufacturing Developments in the Pacific Rim

Association Connecting Electronics Industries (IPC)

2008 International Wafer-Level Packaging Conference Delivers During Tough Times

Industry News | 2008-11-14 11:24:40.0

San Jose, CA � The 5th Annual International Wafer-Level Packaging Conference ended 2008 with success, bringing in its highest attendance yet.

Surface Mount Technology Association (SMTA)

Evolving Technologies Summit Focuses on Embedded Technology, Printed Electronics, and Nano Fillers at SMTA International

Industry News | 2014-08-03 19:58:55.0

The SMTA announced that the Evolving Technologies Summit will be held on September 29, 2014 as a focused symposium at SMTA International in Rosemont, Illinois.

Surface Mount Technology Association (SMTA)

Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open

Industry News | 2022-12-26 11:44:31.0

The SMTA has announced the accepted speakers for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 14-16, 2023 at the Marriott Fremont Silicon Valley in Fremont, California.

Surface Mount Technology Association (SMTA)

Count On Tools to Showcase Its Engineered Solutions for the SMT Industry at the 2019 IPC APEX EXPO

Industry News | 2019-01-05 08:22:29.0

Count On Tools will exhibit in Booth #1637 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29 - 31, 2018 at the San Diego Convention Center in Calif. The COT team will continue its focus on its core product lines at the show:

Count On Tools, Inc.


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