http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product descrip
http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product des
Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product description: Yamaha Flip Chip Bonde,Hybrid Placer, Yamaha flip chip bonding,Yamaha die bo
Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela
Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela
Dispensing nozzle tip also known as writing pen is used to dispense the glue to the die location with the compressed air in most of dispensing process, such as die bonding, electrical circuit connection, structural and circuit board connection. To e
Common dispensing nozzle tip is used to dispense the glue to the die location with the compressed air in most of dispensing process, such as die bonding, electrical circuit connection, structural and circuit board connection. To ensure the glue flow
Liquid Crystal Dispensing Nozzle is used to dispense the liquid crystal in LCD dispensing process. To ensure the liquid crystal flows smoothly, our dispensing nozzles dealt with a high precision processing method have features of integrated design a
Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product description: Yamaha Flip Chip Bonde,Hybrid Placer, Yamaha flip chip bonding,Yamaha die bo
Dispensing tools can be defined as transfer of fluid from a container (usually a syringe) to substrate, one of the best options in meeting the requirement for adhesives in a wide array of packaging assemblies. In order to keep up with the rapid deve
