Electronics Forum | Mon Jan 12 18:06:38 EST 2004 | Kris
Hi, Is there any standard for voids in a leaded device or a chip component ? IPC 7095 lists maximum allowable voiding for BGA devices but has no information on leaded devices Appreciate your help- thanks
Electronics Forum | Wed Oct 26 10:40:43 EDT 2005 | patrickbruneel
Jimmy, We've been soldering tin plated components and Ni/Sn (100% Tin) boards with leaded solder in the 80's in hirel and military applications. We never experienced reliability issues with the mechanical or electrical properties of the solder joint
Electronics Forum | Fri Jan 23 10:39:35 EST 2004 | patrickbruneel
Kris, I assume with voids you mean acceptable solder coverage of pad and lead. As Dave mentioned I also have not seen any specific studies on voids, but workman ship standards exist about acceptable coverage of pad and lead (both consumer and MIL)
Electronics Forum | Tue Feb 15 19:54:48 EST 2000 | Clarissa Ortner
I am supposed to heatsink a Temp sensor with leads .9-1.1mm(.035--43"). I have found on our engineering units that the smallest heat sink I have found commercially is still too heavy for the leads and unless the operators use exxxxtreme care the wei
Electronics Forum | Tue Feb 15 19:54:48 EST 2000 | Clarissa Ortner
I am supposed to heatsink a Temp sensor with leads .9-1.1mm(.035--43"). I have found on our engineering units that the smallest heat sink I have found commercially is still too heavy for the leads and unless the operators use exxxxtreme care the wei
Electronics Forum | Wed Jan 14 08:45:04 EST 2004 | Kris
Thanks Dave Will appreciate if any body has any published information on a study they did for voids in leaded devices Will try to talk to them Dave
Electronics Forum | Tue Oct 25 15:19:15 EDT 2005 | jimmyjames
Sorry this is such a long thread but I would like as much input as possible to everything I ramble on about... :) ------------------------------------------------------ We are now seeing more and more RoHS parts showing up in our SMT inventory and
Electronics Forum | Tue Jan 13 22:07:42 EST 2004 | davef
No, there is no such information. Choices are: * Recognize that any voiding is a process indicator and that when observed, indicate a requirement for taking corrective steps. * Tell your quality people to quit looking at components other than BGA wi
Electronics Forum | Mon Jan 19 18:49:42 EST 2004 | menglong
we are facing the same problem,and we are looking for some research result about voids.who can help to provide these ones ? any suggestion, pls keep me informed contact me :zhanglg@tpv.com.cn
Electronics Forum | Mon Jul 16 09:53:36 EDT 2007 | ed_faranda
Yes, you can use lead-free parts in a leaded process. And the other is true as well, no-lead free parts in a leaded process. BUT, you should not use leaded parts through a non-lead wave solder process and of course, your board will not be RoSH.
