Technical Library: marks (Page 2 of 5)

Methods Used In The Detection Of Counterfeit Electronic Components

Technical Library | 2022-10-04 16:43:10.0

In this paper I will discuss the different methods and equipment used to detect counterfeit electronic parts, specifically integrated circuits as well as demonstrate some of the "red flags" that help to identify a part as being suspected counterfeit. We will begin with the initial receipt of the parts and the examination of the outer packaging, the basic visual inspection of the parts, the visual inspection and documentation at high magnification, permanency marking, blacktop test, scrape test, XRF (RoHS), decapsulation, X-ray, basic electrical testing, C-SAM, full function testing and limited function testing.

Electro-Comp Tape and Reel Services, LLC

Printed Circuit Board Becoming A Vital Arena for Bringing Creativity In Audio Devices

Technical Library | 2016-08-02 06:12:05.0

The audio device industry is set to grow in parallel with the technology triggering across the globe. Also the entertainment and hospitality industry has created an increased demand of audio devices at large. With the enhancement coming up in consumer applications every other day, the recent trend of implementing wireless technology in audio devices has captivated the attention in the market with its growing popularities all over the electronics industry. The recent audio discoveries have marked cosmic developments in the new product launch, business partnership and acquisition globally. With this, the audio device makers are now in race to present a multi featured compact device with giving an appealing dimension experience to the end users in order to survive in the electronic market.

Technotronix

Printed Circuit Board For Industrial Application Drives a wave of Innovation

Technical Library | 2016-08-02 06:04:42.0

The next generation FUNDAS rest on one and only one motto (i.e.) technology up-gradation. For innovations in any corner of the world, a completely unique electronic solution is derived that accounts for fast trending modernization in the lifestyle of humans. With electronic design or manufacturing solution, the printed circuit boards are the groundwork for every electronic project. As the electronic control system and instruments are now applied in every predominant market across the globe, the use of PCB is predicted to have universal application in the global society. This article details you on the type of PCB’s used in the industrial sector, the application of PCB and innovations marked in the industrial sector with current steps taken by PCB manufacturers to provide unique solutions to the industrial sharks. See more: http://www.technotronix.us/pcbblog/printed-circuit-board-for-industrial-application-drives-a-wave-of-innovation/

Technotronix

Automated Optical Inspection Method for Light-Emitting Diode Defect Detection Using Unsupervised Generative Adversarial Neural Network

Technical Library | 2021-11-22 20:44:44.0

Many automated optical inspection (AOI) companies use supervised object detection networks to inspect items, a technique which expends tremendous time and energy to mark defectives. Therefore, we propose an AOI system which uses an unsupervised learning network as the base algorithm to simultaneously generate anomaly alerts and reduce labeling costs. This AOI system works by deploying the GANomaly neural network and the supervised network to the manufacturing system. To improve the ability to distinguish anomaly items from normal items in industry and enhance the overall performance of the manufacturing process, the system uses the structural similarity index (SSIM) as part of the loss function as well as the scoring parameters. Thus, the proposed system will achieve the requirements of smart factories in the future (Industry 4.0).

Shenzhen University

The Future of Solid-State Electronics

Technical Library | 1999-05-06 13:44:43.0

This paper explores the direction in which IC technology is headed, highlights potential roadblocks and possible solutions, and discusses some of the physical considerations that could determine the ultimate limits of integration.

Alcatel-Lucent

Flexible Hybrid Electronics: Direct Interfacing of Soft and Hard Electronics for Wearable Health Monitoring

Technical Library | 2021-08-18 01:30:18.0

The interfacing of soft and hard electronics is a key challenge for flexible hybrid electronics. Currently, a multisubstrate approach is employed, where soft and hard devices are fabricated or assembled on separate substrates, and bonded or interfaced using connectors; this hinders the flexibility of the device and is prone to interconnect issues. Here, a single substrate interfacing approach is reported, where soft devices, i.e., sensors, are directly printed on Kapton polyimide substrates that are widely used for fabricating flexible printed circuit boards (FPCBs).

University of California Berkeley

Intel StrataFlash™ Memory Development and Implementation

Technical Library | 1999-05-07 10:13:38.0

This paper will review the device physics governing the operation of the industry standard ETOX™ flash memory cell and show how it is ideally suited for multiple bit per cell storage, through its storage of electrons on an electrically isolated floating gate and through its direct access to the memory cell.

Intel Corporation

Guide for the Design of Semiconductor Equipment to Meet Voltage Sag Immunity Standards

Technical Library | 1999-08-05 09:51:47.0

This document summarizes the finding of testing to determine the immunity of semiconductor equipment to voltage sag events. Based in part on the findings, global standards have been adopted to define voltage sag immunity requirements for semiconductor equipment...

SEMATECH

Screen and Stencil Printing Processes for Wafer Backside Coating

Technical Library | 2009-09-09 15:08:19.0

Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers.

ASM Assembly Systems (DEK)

Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications

Technical Library | 2010-08-19 18:33:17.0

The silver end termination plays an important role for multilayer chip inductors. A basic requirement is to achieve excellent electrical properties with superior adhesion to the chip. Driven by the increasing price of silver, interest has been shown to

Heraeus


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